Inventor · disambiguated record
Sung-Hui Huang
Also filed as: HUANG SUNG-HUI
92 granted patents·28 pending applications·387 citations·filing 2002–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD86HUANG SUNG-HUI11E INK HOLDINGS INC9TAIWAN SEMICONDUCTOR MFG3TSAI YAO-CHOU3
Top patents by PatentIndex Score
120 records- 0199US11852868B2Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·7 cites·20 claims
- 0299US11493689B2Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 8, 2022·18 cites·20 claims
- 0399US11222867B1Package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 11, 2022·11 cites·20 claims
- 0498US11569156B2Semiconductor device, electronic device including the same, and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 31, 2023·7 cites·20 claims
- 0598US8576475B2MEMS switchHUANG SUNG-HUI·Filed 2011·Granted Nov 5, 2013·109 cites·8 claims
- 0697US12237288B2Semiconductor die package and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·6 cites·20 claims
- 0797US11424219B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 23, 2022·4 cites·20 claims
- 0897US10267988B2Photonic package and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·24 cites·20 claims
- 0996US11990443B2Semiconductor die package and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 21, 2024·4 cites·20 claims
- 1096US10866373B2Optical transceiver and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·9 cites·20 claims
- 1195US11694939B2Semiconductor package, integrated optical communication systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 4, 2023·4 cites·20 claims
- 1295US10746923B2Photonic semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 18, 2020·14 cites·20 claims
- 1395US9355980B2Three-dimensional chip stack and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 31, 2016·19 cites·20 claims
- 1494US11764123B2Semiconductor package, integrated optical communication systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 19, 2023·2 cites·20 claims
- 1594US10770405B2Thermal interface material having different thicknesses in packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 8, 2020·11 cites·20 claims
- 1694US10707177B2Thermal interface material having different thicknesses in packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 7, 2020·11 cites·20 claims
- 1793US10459159B2Photonic package and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 29, 2019·7 cites·20 claims
- 1892US11437334B2Chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 6, 2022·2 cites·20 claims
- 1992US10629545B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 21, 2020·6 cites·20 claims
- 2092US8835913B2Transistor structureE INK HOLDINGS INC·Filed 2012·Granted Sep 16, 2014·9 cites·8 claims
- 2192US8350260B2Transistor structureE INK HOLDINGS INC·Filed 2011·Granted Jan 8, 2013·10 cites·14 claims
- 2291US11705407B2Package structure and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 18, 2023·1 cites·20 claims
- 2391US10948668B2Package structure for optical fiber and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 16, 2021·2 cites·20 claims
- 2491US8895385B2Methods of forming semiconductor structuresTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 25, 2014·10 cites·20 claims
- 2590US11502056B2Joint structure in semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 15, 2022·2 cites·20 claims
- 2690US11450580B2Semiconductor structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 20, 2022·2 cites·20 claims
- 2790US10790254B2Chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 29, 2020·6 cites·20 claims
- 2890US8552485B2Semiconductor structure having metal-insulator-metal capacitor structureCHANG CHUN HUA·Filed 2011·Granted Oct 8, 2013·12 cites·8 claims
- 2989US11502015B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 15, 2022·2 cites·20 claims
- 3089US11156772B2Photonic semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 26, 2021·2 cites·20 claims
- 3189US10985125B2Chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 20, 2021·2 cites·20 claims
- 3288US11150404B2Photonic package and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 19, 2021·4 cites·20 claims
- 3388US11101260B2Method of forming a dummy die of an integrated circuit having an embedded annular structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 24, 2021·4 cites·20 claims
- 3487US2024385398A1Optical transceiver and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3587US2025357427A1Packages with multiple types of underfill and method forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3686US11454773B2Optical transceiver and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·1 cites·20 claims
- 3786US10886147B1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 5, 2021·4 cites·20 claims
- 3886US8466614B2Front light plate and reflective display apparatus using the sameHSIAO PO-WEN·Filed 2010·Granted Jun 18, 2013·7 cites·19 claims
- 3985US12368132B2Joint structure in semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 22, 2025·0 cites·20 claims
- 4085US12294002B2Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted May 6, 2025·0 cites·20 claims
- 4185US2025309188A1Joint structure in semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4285US2025062249A1Package structure and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4384US12242108B2Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 4484US2025062250A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4583US11270956B2Package structure and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 8, 2022·1 cites·20 claims
- 4683US8791909B2Display panelTSAI YAO-CHOU·Filed 2010·Granted Jul 29, 2014·8 cites·14 claims
- 4782US12165992B2Package structure and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 4882US11916023B2Thermal interface material having different thicknesses in packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 27, 2024·1 cites·20 claims
- 4982US10847485B2Chip package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 24, 2020·2 cites·20 claims
- 5082US2025293051A1Package structure with underfillTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
Showing the top 50 of 120 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →