Inventor · disambiguated record
Sungpil Hur
Also filed as: HUR SUNGPIL
2 granted patents·1 citations·filing 2007–2014
31Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0146US9129978B1Integrated circuit packaging system with void prevention mechanism and method of manufacture thereofKIM JAEPIL·Filed 2014·Granted Sep 8, 2015·1 cites·10 claims
- 0237US7863761B2Integrated circuit package system with molding ventsSTATS CHIPPAC LTD·Filed 2007·Granted Jan 4, 2011·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →