Inventor · disambiguated record
Suhyung Hwang
Also filed as: HWANG SUHYUNG
19 granted patents·6 pending applications·20 citations·filing 2018–2025
89Inventor score
Files withQUALCOMM INC25
Top patents by PatentIndex Score
25 records- 0195US11183446B1X.5 layer substrateQUALCOMM INC·Filed 2020·Granted Nov 23, 2021·4 cites·28 claims
- 0293US11495873B2Device comprising multi-directional antennas in substrates coupled through flexible interconnectsQUALCOMM INC·Filed 2020·Granted Nov 8, 2022·5 cites·25 claims
- 0392US11239573B2Sub-module L-shaped millimeter wave antenna-in-packageQUALCOMM INC·Filed 2020·Granted Feb 1, 2022·3 cites·17 claims
- 0490US12125742B2Package comprising a substrate with high density interconnectsQUALCOMM INC·Filed 2021·Granted Oct 22, 2024·2 cites·23 claims
- 0590US11696390B2Systems for shielding bent signal linesQUALCOMM INC·Filed 2020·Granted Jul 4, 2023·3 cites·29 claims
- 0681US12126071B2Multi-directional antenna modules employing a surface-mount antenna(s) to support antenna pattern multi-directionality, and related fabrication methodsQUALCOMM INC·Filed 2022·Granted Oct 22, 2024·1 cites·21 claims
- 0780US11545425B2Substrate comprising interconnects embedded in a solder resist layerQUALCOMM INC·Filed 2020·Granted Jan 3, 2023·1 cites·24 claims
- 0876US11439008B2Package with substrate comprising variable thickness solder resist layerQUALCOMM INC·Filed 2021·Granted Sep 6, 2022·1 cites·25 claims
- 0970US2025259948A1Package comprising discrete antenna deviceQUALCOMM INC·Filed 2025·Application pending·0 cites
- 1069US11764489B2Sub-module L-shaped millimeter wave antenna-in-packageQUALCOMM INC·Filed 2022·Granted Sep 19, 2023·0 cites·20 claims
- 1163US2023155273A1Device comprising multi-directional antennas in substrates coupled through flexible interconnectsQUALCOMM INC·Filed 2022·Application pending·0 cites
- 1259US12293980B2Package comprising discrete antenna deviceQUALCOMM INC·Filed 2020·Granted May 6, 2025·0 cites·17 claims
- 1358US11399435B2Device comprising multi-directional antennas coupled through a flexible printed circuit boardQUALCOMM INC·Filed 2020·Granted Jul 26, 2022·0 cites·25 claims
- 1458US2025096051A1Package comprising a substrate with cavity, and an integrated device located in the cavity of the substrateQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1554US11869833B2Package comprising a substrate with a via interconnect coupled to a trace interconnect and method of fabricating the sameQUALCOMM INC·Filed 2021·Granted Jan 9, 2024·0 cites·14 claims
- 1653US11823983B2Package with a substrate comprising pad-on-pad interconnectsQUALCOMM INC·Filed 2021·Granted Nov 21, 2023·0 cites·30 claims
- 1753US11735804B2Multi-core broadband PCB antennaQUALCOMM INC·Filed 2020·Granted Aug 22, 2023·0 cites·20 claims
- 1853US2025226302A1Hybrid substrate with embedded componentQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1952US12300873B2Antenna modules employing a package substrate with a vertically-integrated patch antenna(s), and related fabrication methodsQUALCOMM INC·Filed 2022·Granted May 13, 2025·0 cites·33 claims
- 2050US11043740B2Enhanced antenna module with shield layerQUALCOMM INC·Filed 2019·Granted Jun 22, 2021·0 cites·19 claims
- 2149US11258165B2Asymmetric antenna structureQUALCOMM INC·Filed 2018·Granted Feb 22, 2022·0 cites·8 claims
- 2249US11139224B2Package comprising a substrate having a via wall configured as a shieldQUALCOMM INC·Filed 2019·Granted Oct 5, 2021·0 cites·22 claims
- 2348US11551939B2Substrate comprising interconnects embedded in a solder resist layerQUALCOMM INC·Filed 2020·Granted Jan 10, 2023·0 cites·20 claims
- 2444US2021028539A1Enhanced Antenna Module with Flexible PortionQUALCOMM INC·Filed 2019·Application pending·0 cites
- 2542US2023014567A1Package substrate employing integrated slot-shaped antenna(s), and related integrated circuit (ic) packages and fabrication methodsQUALCOMM INC·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →