Inventor · disambiguated record
Sushumna Iruvanti
Also filed as: IRUVANTI SUSHUMNA
61 granted patents·6 pending applications·2,006 citations·filing 1989–2023
99Inventor score
Top patents by PatentIndex Score
67 records- 0197US6444496B1Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereofIBM·Filed 2000·Granted Sep 3, 2002·123 cites·10 claims
- 0296US7816785B2Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and packageIBM·Filed 2009·Granted Oct 19, 2010·45 cites·10 claims
- 0396US5623394AApparatus for cooling of chips using a plurality of customized thermally conductive materialsIBM·Filed 1996·Granted Apr 22, 1997·121 cites·18 claims
- 0493US7709951B2Thermal pillowIBM·Filed 2007·Granted May 4, 2010·27 cites·20 claims
- 0593US6294408B1Method for controlling thermal interface gap distanceIBM·Filed 1999·Granted Sep 25, 2001·156 cites·18 claims
- 0693US5724729AMethod and apparatus for cooling of chips using a plurality of customized thermally conductive materialsIBM·Filed 1996·Granted Mar 10, 1998·71 cites·18 claims
- 0792US5990418AHermetic CBGA/CCGA structure with thermal paste coolingIBM·Filed 1997·Granted Nov 23, 1999·156 cites·19 claims
- 0892US5604978AMethod for cooling of chips using a plurality of materialsIBM·Filed 1995·Granted Feb 25, 1997·67 cites·17 claims
- 0991US8156998B2Patterned metal thermal interfaceFURMAN BRUCE K·Filed 2010·Granted Apr 17, 2012·12 cites·18 claims
- 1090US7694719B2Patterned metal thermal interfaceIBM·Filed 2007·Granted Apr 13, 2010·18 cites·16 claims
- 1190US6275381B1Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereofIBM·Filed 1998·Granted Aug 14, 2001·65 cites·12 claims
- 1290US6085831ADirect chip-cooling through liquid vaporization heat exchangeIBM·Filed 1999·Granted Jul 11, 2000·115 cites·51 claims
- 1390US5098609AStable high solids, high thermal conductivity pastesRES FOUNDATION OF STATE UNIV O·Filed 1989·Granted Mar 24, 1992·91 cites·14 claims
- 1489US7268428B2Thermal paste containment for semiconductor modulesIBM·Filed 2005·Granted Sep 11, 2007·25 cites·6 claims
- 1589US5825087AIntegral mesh flat plate cooling moduleIBM·Filed 1996·Granted Oct 20, 1998·100 cites·16 claims
- 1689US5591789APolyester dispersants for high thermal conductivity pasteIBM·Filed 1995·Granted Jan 7, 1997·50 cites·17 claims
- 1787US8053284B2Method and package for circuit chip packagingIBM·Filed 2009·Granted Nov 8, 2011·15 cites·12 claims
- 1886US11152282B1Localized catalyst for enhanced thermal interface material heat transferIBM·Filed 2020·Granted Oct 19, 2021·2 cites·20 claims
- 1985US5659203AReworkable polymer chip encapsulantIBM·Filed 1995·Granted Aug 19, 1997·71 cites·16 claims
- 2084US8455998B2Method and package for circuit chip packagingIRUVANTI SUSHUMNA·Filed 2011·Granted Jun 4, 2013·8 cites·13 claims
- 2184US7381590B2Method and device including reworkable alpha particle barrier and corrosion barrierIBM·Filed 2006·Granted Jun 3, 2008·6 cites·15 claims
- 2284US5770478AIntegral mesh flat plate cooling methodIBM·Filed 1997·Granted Jun 23, 1998·71 cites·6 claims
- 2383US5819402AMethod for cooling of chips using blind holes with customized depthIBM·Filed 1997·Granted Oct 13, 1998·63 cites·16 claims
- 2482US11302651B2Laminated stiffener to control the warpage of electronic chip carriersIBM·Filed 2019·Granted Apr 12, 2022·2 cites·19 claims
- 2582US5981310AMulti-chip heat-sink cap assemblyIBM·Filed 1998·Granted Nov 9, 1999·59 cites·11 claims
- 2680US9045674B2High thermal conductance thermal interface materials based on nanostructured metallic network-polymer compositesIRUVANTI SUSHUMNA·Filed 2012·Granted Jun 2, 2015·5 cites·19 claims
- 2780US5706171AFlat plate cooling using a thermal paste retainerIBM·Filed 1995·Granted Jan 6, 1998·53 cites·18 claims
- 2879US5881945AMulti-layer solder seal band for semiconductor substrates and processIBM·Filed 1997·Granted Mar 16, 1999·57 cites·26 claims
- 2978US5881944AMulti-layer solder seal band for semiconductor substratesIBM·Filed 1997·Granted Mar 16, 1999·53 cites·21 claims
- 3078US5757620AApparatus for cooling of chips using blind holes with customized depthIBM·Filed 1996·Granted May 26, 1998·50 cites·26 claims
- 3177US11158562B2Conformal integrated circuit (IC) device package lidIBM·Filed 2020·Granted Oct 26, 2021·1 cites·19 claims
- 3276US10804181B2Heterogeneous thermal interface material for corner and or edge degradation mitigationIBM·Filed 2019·Granted Oct 13, 2020·2 cites·7 claims
- 3375US7981849B2Reversible thermal thickening greaseIBM·Filed 2007·Granted Jul 19, 2011·2 cites·15 claims
- 3475US7615850B2Method and device including reworkable alpha particle barrier and corrosion barrierIBM·Filed 2008·Granted Nov 10, 2009·2 cites·3 claims
- 3573US10607928B1Reduction of laminate failure in integrated circuit (IC) device carrierIBM·Filed 2019·Granted Mar 31, 2020·1 cites·20 claims
- 3673US10593564B2Lid attach optimization to limit electronic package warpageIBM·Filed 2018·Granted Mar 17, 2020·1 cites·6 claims
- 3773US8531025B2Thermal paste containment for semiconductor modulesEDWARDS DAVID L·Filed 2007·Granted Sep 10, 2013·9 cites·15 claims
- 3873US6656389B2Thermal paste for low temperature applicationsIBM·Filed 2001·Granted Dec 2, 2003·21 cites·16 claims
- 3973US5930597AReworkable polymer chip encapsulantIBM·Filed 1997·Granted Jul 27, 1999·38 cites·6 claims
- 4072US10083886B2Lid attach optimization to limit electronic package warpageIBM·Filed 2017·Granted Sep 25, 2018·1 cites·7 claims
- 4172US8232636B2Reliability enhancement of metal thermal interfaceHUMENIK JAMES N·Filed 2010·Granted Jul 31, 2012·5 cites·24 claims
- 4272US8021925B2Thermal paste containment for semiconductor modulesIBM·Filed 2007·Granted Sep 20, 2011·9 cites·16 claims
- 4372US6515061B1Polyester dispersants for high thermal conductivity pasteIBM·Filed 1997·Granted Feb 4, 2003·21 cites·19 claims
- 4470US6373133B1Multi-chip module and heat-sink cap combinationIBM·Filed 1999·Granted Apr 16, 2002·34 cites·15 claims
- 4569US11569181B2Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafersIBM·Filed 2020·Granted Jan 31, 2023·0 cites·11 claims
- 4669US9512291B2High thermal conductance thermal interface materials based on nanostructured metallic network-polymer compositesIBM·Filed 2015·Granted Dec 6, 2016·1 cites·19 claims
- 4769US5891755AProcess for flat plate cooling a semiconductor chip using a thermal paste retainerIBM·Filed 1997·Granted Apr 6, 1999·31 cites·4 claims
- 4867US10049896B2Lid attach optimization to limit electronic package warpageIBM·Filed 2015·Granted Aug 14, 2018·1 cites·3 claims
- 4963US6111314AThermal cap with embedded particlesIBM·Filed 1998·Granted Aug 29, 2000·23 cites·48 claims
- 5060US10892233B2Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafersIBM·Filed 2018·Granted Jan 12, 2021·0 cites·7 claims
Showing the top 50 of 67 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Sushumna Iruvanti files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →