Inventor · disambiguated record
Susheel Jadhav
Also filed as: JADHAV SUSHEEL · JADHAV SUSHEEL G
12 granted patents·2 pending applications·123 citations·filing 2003–2021
91Inventor score
Technology areasH10W
Top patents by PatentIndex Score
14 records- 0193US7239517B2Integrated heat spreader and method for usingINTEL CORP·Filed 2005·Granted Jul 3, 2007·25 cites·7 claims
- 0289US7955900B2Coated thermal interface in integrated circuit dieINTEL CORP·Filed 2006·Granted Jun 7, 2011·20 cites·17 claims
- 0389US7534715B2Methods including fluxless chip attach processesINTEL CORP·Filed 2005·Granted May 19, 2009·22 cites·25 claims
- 0487US7183641B2Integrated heat spreader with intermetallic layer and method for makingINTEL CORP·Filed 2005·Granted Feb 27, 2007·15 cites·16 claims
- 0586US11894474B2Silicon photonic integrated lens compatible with wafer processingINTEL CORP·Filed 2019·Granted Feb 6, 2024·5 cites·11 claims
- 0675US8733620B2Solder deposition and thermal processing of thin-die thermal interface materialRENAVIKAR MUKUL·Filed 2005·Granted May 27, 2014·8 cites·7 claims
- 0773US7485495B2Integrated heat spreader with intermetallic layer and method for makingINTEL CORP·Filed 2007·Granted Feb 3, 2009·5 cites·17 claims
- 0869US11715928B2Decoupling layer to reduce underfill stress in semiconductor devicesINTEL CORP·Filed 2019·Granted Aug 1, 2023·1 cites·20 claims
- 0964US7164585B2Thermal interface apparatus, systems, and methodsINTEL CORP·Filed 2003·Granted Jan 16, 2007·11 cites·17 claims
- 1063US7553702B2Integrating a heat spreader with an interface material having reduced void sizeINTEL CORP·Filed 2007·Granted Jun 30, 2009·2 cites·18 claims
- 1160US7220622B2Method for attaching a semiconductor die to a substrate and heat spreaderINTEL CORP·Filed 2004·Granted May 22, 2007·9 cites·16 claims
- 1254US12266608B2Integrated photonics and processor package with redistribution layer and EMIB connectorINTEL CORP·Filed 2020·Granted Apr 1, 2025·0 cites·12 claims
- 1345US2021210478A1Packaging solutions for high bandwidth networking applicationsINTEL CORP·Filed 2021·Application pending·0 cites
- 1439US2016260679A1Hybrid interconnect for low temperature attachINTEL CORP·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →