Inventor · disambiguated record
Sung Jun Ji
Also filed as: JI SUNG JUN
4 granted patents·4 pending applications·2 citations·filing 2021–2025
57Inventor score
Files withEGTM CO LTD8
Top patents by PatentIndex Score
8 records- 0187US11634441B2Group 5 metal compound for thin film deposition and method of forming group 5 metal-containing thin film using sameEGTM CO LTD·Filed 2021·Granted Apr 25, 2023·2 cites·2 claims
- 0259US11926897B2Niobium precursor compound for thin film deposition and method for forming niobium-containing thin film using sameEGTM CO LTD·Filed 2022·Granted Mar 12, 2024·0 cites·17 claims
- 0356US12281130B2Organometallic precursor compoundEGTM CO LTD·Filed 2021·Granted Apr 22, 2025·0 cites·3 claims
- 0456US11958874B2Organo tin compound for thin film deposition and method for forming tin-containing thin film using sameEGTM CO LTD·Filed 2022·Granted Apr 16, 2024·0 cites·9 claims
- 0556US2023339985A1Organometallic Compound For Thin Film Deposition And Method For Forming Group 4 Metal-Containing Thin Film Using SameEGTM CO LTD·Filed 2023·Application pending·0 cites
- 0656US2025376764A1Compound for forming molybdenum-containing thin film, molybdenum-containing thin film and manufacturing method thereofEGTM CO LTD·Filed 2025·Application pending·0 cites
- 0755US2025201549A1Precursor for forming silicon-containing thin film with high hardness and low dielectric constant and manufacturing method for silicon-containing thin film using thereofEGTM CO LTD·Filed 2024·Application pending·0 cites
- 0850US2025285886A1Method of treating thin films and method of manufacturing memory deviceEGTM CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →