Inventor · disambiguated record
Sungeun Jo
Also filed as: JO SUNGEUN
9 granted patents·7 pending applications·11 citations·filing 2018–2024
80Inventor score
Files withSAMSUNG ELECTRONICS CO LTD16
Top patents by PatentIndex Score
16 records- 0182US11393859B2Image sensor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 19, 2022·5 cites·16 claims
- 0277US11125734B2Gas sensor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 21, 2021·3 cites·18 claims
- 0375US10760930B2Sensor package, method of manufacturing the same, and method of manufacturing lid structureSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 1, 2020·2 cites·11 claims
- 0468US12506047B2Semiconductor package and cooling systemSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 23, 2025·0 cites·19 claims
- 0564US11067554B2Gas sensor package and sensing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 20, 2021·1 cites·20 claims
- 0661US11131568B2Sensor package, method of manufacturing the same, and method of manufacturing lid structureSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 28, 2021·0 cites·20 claims
- 0757US12388048B2Semiconductor package comprising heat spreaderSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 12, 2025·0 cites·20 claims
- 0856US2020372232A1Fingerprint sensor package and display apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 0955US2024234287A9Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1054US2025201643A1Stacked ic packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1153US10776601B2Fingerprint sensor package and display apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 15, 2020·0 cites·20 claims
- 1253US2023352411A1Semiconductor package and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1352US2024243110A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1450US12431403B2Semiconductor package including thermal interface material (TIM) layers on semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 30, 2025·0 cites·16 claims
- 1550US2023178450A1Film packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1649US2025053208A1Computing system with cooling configurationSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →