Inventor · disambiguated record
Sungjoon Joo
Also filed as: JOO SUNGJOON
1 granted patent·1 pending application·0 citations·filing 2022–2024
10Inventor score
Files withSAMSUNG ELECTRONICS CO LTD2
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2 records- 0151US2025214181A1Solder composition, method of preparing the same, and method of manufacturing semiconductor package using the solder compositionSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0249US11813716B2Substrate processing apparatus having chamber coverSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 14, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →