Inventor · disambiguated record
Suk-Chun Jung
Also filed as: JUNG SUK-CHUN
1 granted patent·2 pending applications·3 citations·filing 2004–2005
20Inventor score
Top patents by PatentIndex Score
3 records- 0145US7631795B2System and method for automated wire bondingSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Dec 15, 2009·3 cites·20 claims
- 0233US2005269713A1Apparatus and method for wire bonding and die attachingOH KOOK-JIN·Filed 2005·Application pending·0 cites
- 0332US2005126696A1Snap cure device for semiconductor chip attachmentFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →