Inventor · disambiguated record
Susumu Kagohashi
Also filed as: KAGOHASHI SUSUMU
5 granted patents·19 pending applications·14 citations·filing 2000–2025
68Inventor score
Files withIBIDEN CO LTD24
Top patents by PatentIndex Score
24 records- 0184US12477663B2Printed wiring boardIBIDEN CO LTD·Filed 2023·Granted Nov 18, 2025·1 cites·20 claims
- 0281US2025374425A1Printed wiring boardIBIDEN CO LTD·Filed 2025·Application pending·0 cites
- 0373US2024237201A1Printed wiring boardIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 0470US12414231B2Printed wiring boardIBIDEN CO LTD·Filed 2023·Granted Sep 9, 2025·0 cites·20 claims
- 0568US12484159B2Wiring substrate and method for manufacturing the sameIBIDEN CO LTD·Filed 2023·Granted Nov 25, 2025·0 cites·20 claims
- 0666US2023071257A1Printed wiring boardIBIDEN CO LTD·Filed 2022·Application pending·0 cites
- 0763US6645297B1Roll coater for coating and method of manufacturing printed wiring board employing the roll coaterIBIDEN CO LTD·Filed 2000·Granted Nov 11, 2003·13 cites·7 claims
- 0863US2025311115A1Method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2025·Application pending·0 cites
- 0962US12279368B2Printed wiring boardIBIDEN CO LTD·Filed 2022·Granted Apr 15, 2025·0 cites·20 claims
- 1058US2025008651A1Printed wiring boardIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 1154US2024268038A1Printed wiring boardIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 1253US2024363541A1Wiring substrateIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 1353US2024292536A1Printed wiring boardIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 1452US2025048562A1Wiring substrateIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 1552US2025008652A1Printed wiring boardIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 1651US2024365468A1Wiring substrateIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 1751US2024407094A1Printed wiring boardIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 1850US2024284606A1Wiring substrateIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 1950US2025311097A1Wiring substrateIBIDEN CO LTD·Filed 2025·Application pending·0 cites
- 2049US2024196526A1Wiring substrateIBIDEN CO LTD·Filed 2023·Application pending·0 cites
- 2149US2023328882A1Printed wiring boardIBIDEN CO LTD·Filed 2023·Application pending·0 cites
- 2248US2024339393A1Wiring substrateIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 2346US2024341033A1Wiring substrateIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 2446US2024341034A1Wiring substrateIBIDEN CO LTD·Filed 2024·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Susumu Kagohashi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →