Inventor · disambiguated record
Suryanarayana Kaja
Also filed as: KAJA SURYANARAYANA
26 granted patents·911 citations·filing 1987–2003
97Inventor score
Top patents by PatentIndex Score
26 records- 0197US5380560APalladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal depositionIBM·Filed 1992·Granted Jan 10, 1995·327 cites·20 claims
- 0291US5898222ACapped copper electrical interconnectsIBM·Filed 1997·Granted Apr 27, 1999·95 cites·30 claims
- 0390US6329609B1Method and structure to prevent distortion and expansion of organic spacer layer for thin film transfer-join technologyIBM·Filed 2000·Granted Dec 11, 2001·64 cites·15 claims
- 0489US5549808AMethod for forming capped copper electrical interconnectsIBM·Filed 1995·Granted Aug 27, 1996·113 cites·30 claims
- 0581US5545927ACapped copper electrical interconnectsIBM·Filed 1995·Granted Aug 13, 1996·50 cites·8 claims
- 0678US5382447AProcess for fabricating improved multilayer interconnect systemsIBM·Filed 1993·Granted Jan 17, 1995·49 cites·16 claims
- 0774US6669833B2Process and apparatus for electroplating microscopic features uniformly across a large substrateIBM·Filed 2003·Granted Dec 30, 2003·20 cites·41 claims
- 0874US6126761AProcess of controlling grain growth in metal filmsIBM·Filed 1998·Granted Oct 3, 2000·29 cites·5 claims
- 0963US5787578AMethod of selectively depositing a metallic layer on a ceramic substrateIBM·Filed 1996·Granted Aug 4, 1998·31 cites·19 claims
- 1060US5705857ACapped copper electrical interconnectsIBM·Filed 1996·Granted Jan 6, 1998·20 cites·5 claims
- 1157US6271111B1High density pluggable connector array and process thereofIBM·Filed 1998·Granted Aug 7, 2001·19 cites·8 claims
- 1257US6077405AMethod and apparatus for making electrical contact to a substrate during electroplatingIBM·Filed 1998·Granted Jun 20, 2000·11 cites·17 claims
- 1354US6131796ADirect brazing of refractory metal featuresIBM·Filed 1997·Granted Oct 17, 2000·16 cites·11 claims
- 1452US4860572AApparatus and methods for testing surface properties of a materialMAGNETIC PERIPHERALS INC·Filed 1988·Granted Aug 29, 1989·14 cites·4 claims
- 1547US6455331B2Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devicesIBM·Filed 2001·Granted Sep 24, 2002·3 cites·3 claims
- 1645US6638374B2Device produced by a process of controlling grain growth in metal filmsIBM·Filed 2002·Granted Oct 28, 2003·2 cites·7 claims
- 1745US6361627B1Process of controlling grain growth in metal filmsIBM·Filed 2000·Granted Mar 26, 2002·2 cites·9 claims
- 1845US6241868B1Method for electroplating a film onto a substrateIBM·Filed 2000·Granted Jun 5, 2001·0 cites·14 claims
- 1944US5453642AMultilayer interconnect systemsIBM·Filed 1994·Granted Sep 26, 1995·11 cites·6 claims
- 2044US4776202AApparatus and methods for testing surface properties of a materialMAGNETIC PERIPHERALS INC·Filed 1987·Granted Oct 11, 1988·10 cites·1 claims
- 2139US5935404AMethod of performing processes on features with electricityIBM·Filed 1997·Granted Aug 10, 1999·7 cites·10 claims
- 2235US6048741ATop-surface-metallurgy plate-up bonding and rewiring for multilayer devicesIBM·Filed 1997·Granted Apr 11, 2000·6 cites·21 claims
- 2333US5483105AModule input-output pad having stepped set-backIBM·Filed 1994·Granted Jan 9, 1996·5 cites·9 claims
- 2432US5985128AMethod of performing processes on features with electricityIBM·Filed 1999·Granted Nov 16, 1999·2 cites·10 claims
- 2530US6248599B1Top-surface-metallurgy plate-up bonding and rewiring for multilayer devicesIBM·Filed 1999·Granted Jun 19, 2001·2 cites·3 claims
- 2621US4821578AApparatus and methods for testing surface properties of a materialMAGNETIC PERIPHEALS INC·Filed 1988·Granted Apr 18, 1989·3 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →