Inventor · disambiguated record
Sungsig Kang
Also filed as: KANG SUNGSIG
1 granted patent·3 pending applications·0 citations·filing 2020–2025
10Inventor score
Technology areasH10W
Files withHERAEUS MATERIALS SINGAPORE PTE LTD4
Top patents by PatentIndex Score
4 records- 0140US12404598B2Coated wireHERAEUS MATERIALS SINGAPORE PTE LTD·Filed 2021·Granted Sep 2, 2025·0 cites·17 claims
- 0239US2024006191A1Process for the manufacture of encapsulated semiconductor dies and/or of encapsulated semiconductor packagesHERAEUS MATERIALS SINGAPORE PTE LTD·Filed 2020·Application pending·0 cites
- 0337US2025239566A1Pressureless sintering method for the connection of electronic componentsHERAEUS MATERIALS SINGAPORE PTE LTD·Filed 2025·Application pending·0 cites
- 0434US2025015037A1Ball-bond arrangementHERAEUS MATERIALS SINGAPORE PTE LTD·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →