Inventor · disambiguated record
Su Bin Kang
Also filed as: KANG SU-BIN
7 granted patents·7 pending applications·20 citations·filing 2013–2023
74Inventor score
Top patents by PatentIndex Score
14 records- 0194US10566346B2Vertical-type memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 18, 2020·20 cites·19 claims
- 0257US11004866B2Vertical-type memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 11, 2021·0 cites·20 claims
- 0356US2024120269A1Power module and manufacturing method thereofHYUNDAI MOTOR CO LTD·Filed 2023·Application pending·0 cites
- 0454US10622276B2Power moduleHYUNDAI MOTOR CO LTD·Filed 2018·Granted Apr 14, 2020·0 cites·3 claims
- 0551US2015183063A1Method of joining silver pasteHYUNDAI MOTOR CO LTD·Filed 2014·Application pending·0 cites
- 0651US2023187403A1Method for manufacturing double-sided cooling type power module and double-sided cooling type power moduleHYUNDAI MOTOR CO LTD·Filed 2022·Application pending·0 cites
- 0749US10062631B2Power moduleHYUNDAI MOTOR CO LTD·Filed 2016·Granted Aug 28, 2018·0 cites·11 claims
- 0848US2018102201A1Stretchable conductive fiber and method of manufacturing the sameUNIV YONSEI IACF·Filed 2017·Application pending·0 cites
- 0944US2015179794A1Semiconductor device and method of manufacturing the sameHYUNDAI MOTOR CO LTD·Filed 2014·Application pending·0 cites
- 1042US2015187725A1Method of joining silver pasteHYUNDAI MOTOR CO LTD·Filed 2014·Application pending·0 cites
- 1140US2014183557A1Semiconductor device structure for ohmic contact and method for fabricating the sameHYUNDAI MOTOR CO LTD·Filed 2013·Application pending·0 cites
- 1239US10998327B2Semiconductor device including separation linesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 4, 2021·0 cites·20 claims
- 1336US9972597B2Method of bonding with silver pasteHYUNDAI MOTOR CO LTD·Filed 2015·Granted May 15, 2018·0 cites·7 claims
- 1435US9589925B2Method for bonding with a silver pasteHYUNDAI MOTOR CO LTD·Filed 2015·Granted Mar 7, 2017·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →