Inventor · disambiguated record
Suku Kim
Also filed as: KIM SUKU
9 granted patents·7 pending applications·27 citations·filing 2008–2013
84Inventor score
Top patents by PatentIndex Score
16 records- 0179US8058732B2Semiconductor die structures for wafer-level chipscale packaging of power devices, packages and systems for using the same, and methods of making the sameGRUENHAGEN MICHAEL D·Filed 2008·Granted Nov 15, 2011·10 cites·33 claims
- 0273US7960800B2Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the sameFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Jun 14, 2011·5 cites·13 claims
- 0372US8598035B2Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the sameGRUENHAGEN MICHAEL D·Filed 2011·Granted Dec 3, 2013·3 cites·10 claims
- 0470US8343852B2Method and structure for dividing a substrate into individual devicesFAIRCHILD SEMICONDUCTOR·Filed 2011·Granted Jan 1, 2013·2 cites·15 claims
- 0562US7951688B2Method and structure for dividing a substrate into individual devicesFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted May 31, 2011·1 cites·8 claims
- 0661US8072027B23D channel architecture for semiconductor devicesKIM SUKU·Filed 2009·Granted Dec 6, 2011·3 cites·24 claims
- 0760US8158506B2Methods and designs for localized wafer thinningKIM SUKU·Filed 2008·Granted Apr 17, 2012·2 cites·18 claims
- 0856US8129778B2Semiconductor devices and methods for making the sameKIM SUKU·Filed 2009·Granted Mar 6, 2012·1 cites·20 claims
- 0947US8624393B2Methods and designs for localized wafer thinningKIM SUKU·Filed 2012·Granted Jan 7, 2014·0 cites·19 claims
- 1047US2014103428A1Trench superjunction mosfet with thin epi processFAIRCHILD SEMICONDUCTOR·Filed 2013·Application pending·0 cites
- 1143US2011006409A1Nickel-titanum contact layers in semiconductor devicesGRUENHAGEN MICHAEL D·Filed 2009·Application pending·0 cites
- 1241US2011031596A1Nickel-titanum soldering layers in semiconductor devicesGRUENHAGEN MIKE D·Filed 2009·Application pending·0 cites
- 1339US2012018800A1Trench Superjunction MOSFET with Thin EPI ProcessKIM SUKU·Filed 2010·Application pending·0 cites
- 1435US2013087852A1Edge termination structure for power semiconductor devicesKIM SUKU·Filed 2011·Application pending·0 cites
- 1533US2011198689A1Semiconductor devices containing trench mosfets with superjunctionsKIM SUKU·Filed 2010·Application pending·0 cites
- 1633US2012306009A1Integration of superjunction mosfet and diodeKIM SUKU·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Suku Kim files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →