Inventor · disambiguated record
Sung-Hyup Kim
Also filed as: KIM SUNG-HYUP
13 granted patents·7 pending applications·19 citations·filing 2006–2024
86Inventor score
Files withSAMSUNG ELECTRONICS CO LTD20
Top patents by PatentIndex Score
20 records- 0195US12051601B2Method of bonding substrates utilizing a substrate holder with holding fingersSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 30, 2024·2 cites·20 claims
- 0285US11127654B2Semiconductor device and a manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 21, 2021·5 cites·14 claims
- 0382US10811287B2Spin coater and substrate treating apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 20, 2020·3 cites·16 claims
- 0479US11640912B2Apparatus for bonding substrates having a substrate holder with holding fingers and method of bonding substratesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 2, 2023·2 cites·19 claims
- 0579US9791855B2Semiconductor process management system, semiconductor manufacturing system including the same, and method of manufacturing semiconductorSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Oct 17, 2017·2 cites·20 claims
- 0670US10763243B2Substrate bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 1, 2020·1 cites·18 claims
- 0770US7792453B2Image forming apparatus with opening/closing memberSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Sep 7, 2010·4 cites·16 claims
- 0862US2025226253A1Wafer cleaning apparatus and wafer cleaning system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0959US12199014B2Semiconductor device and a manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 14, 2025·0 cites·6 claims
- 1056US12513810B2EUV generator, EUV lithography apparatus including the same, and method for fabricating semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 1154US2024411235A1Semiconductor manufacturing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1252US10971379B2Wafer bonding apparatus and wafer bonding system using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 6, 2021·0 cites·20 claims
- 1347US10295564B2Apparatus for clamping a probe card and probe card including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 21, 2019·0 cites·18 claims
- 1446US10811381B2Wafer to wafer bonding method and wafer to wafer bonding systemSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 20, 2020·0 cites·13 claims
- 1546US2024234153A1Wafer polishing system, simulation and control method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1645US2007115644A1Method of cooling electronic device and electronic device with improved cooling efficiencySAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1744US2020070300A1Chemical mechanical polishing apparatus and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 1840US2020070223A1Jig for cleaning a bowl of a spin coater and apparatus for cleaning a bowl of a spin coater including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 1937US2020020562A1Vacuum chuck for bonding substrates, apparatus for bonding substrates including the same, and method of bonding substrates using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 2033US10937670B2Megasonic cleanerSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Mar 2, 2021·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →