Inventor · disambiguated record
Sunchul Kim
Also filed as: KIM SUNCHUL
14 granted patents·9 pending applications·46 citations·filing 2017–2024
89Inventor score
Top patents by PatentIndex Score
23 records- 0195US11309228B2Packaged semiconductor devices having enhanced thermal transport and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 19, 2022·6 cites·18 claims
- 0293US11526247B2Touch display device, touch circuit and touch driving method thereofLG DISPLAY CO LTD·Filed 2021·Granted Dec 13, 2022·3 cites·16 claims
- 0392US10475749B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 12, 2019·13 cites·19 claims
- 0491US10825774B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 3, 2020·7 cites·20 claims
- 0590US10622340B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 14, 2020·9 cites·18 claims
- 0686US10510672B2Semiconductor packages and methods of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 17, 2019·6 cites·20 claims
- 0776US11133296B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 28, 2021·2 cites·18 claims
- 0873US12406934B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 2, 2025·0 cites·20 claims
- 0968US11557574B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 17, 2023·0 cites·20 claims
- 1066US11437326B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 6, 2022·0 cites·20 claims
- 1159US11075189B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 27, 2021·0 cites·20 claims
- 1259US2025070012A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1358US2025176104A1Printed circuit board and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1458US2025079232A1Semiconductor package bonding tool and semiconductor package fabrication method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1554US2025174596A1Method of manufacturing semiconductor package and apparatus for manufacturing semiconductor package used thereforSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1654US2025201757A1Chip bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1754US2025219014A1Semiconductor reflow apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1852US2023126102A1Semiconductor package structure having interposer substrate, and stacked semiconductor package structure including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1951US11515262B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 29, 2022·0 cites·20 claims
- 2051US2024321823A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2149US11257786B2Semiconductor package including molding member, heat dissipation member, and reinforcing memberSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 22, 2022·0 cites·19 claims
- 2247US11482507B2Semiconductor package having molding member and heat dissipation memberSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 25, 2022·0 cites·11 claims
- 2343US2023063578A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →