Inventor · disambiguated record
Sunghyup Kim
Also filed as: KIM SungHyup
18 granted patents·23 pending applications·19 citations·filing 2016–2025
89Inventor score
Top patents by PatentIndex Score
41 records- 0192US11607741B2Semiconductor chip bonding apparatus including head having thermally conductive materialsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 21, 2023·7 cites·20 claims
- 0289US11538697B2Substrate processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 27, 2022·2 cites·20 claims
- 0388US11231656B2Target debris collection device and extreme ultraviolet light source apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 25, 2022·2 cites·20 claims
- 0486US11599031B2Target debris collection device and extreme ultraviolet light source apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 7, 2023·1 cites·20 claims
- 0582US11711883B2Droplet accelerating assembly and extreme ultra-violet lithography apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 25, 2023·1 cites·19 claims
- 0681US10672629B2Ring assembly and chuck assembly having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 2, 2020·5 cites·23 claims
- 0778US11837573B2Chip bonding apparatus and method of manufacturing semiconductor device using the apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 5, 2023·1 cites·12 claims
- 0874US11852984B2Target debris collection device and extreme ultraviolet light source apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 26, 2023·0 cites·20 claims
- 0968US11848301B2Method of manufacturing a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 19, 2023·0 cites·20 claims
- 1066US11454882B2Pellicle for reflective maskSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 27, 2022·0 cites·20 claims
- 1164US12298676B2Substrate processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 1264US2025216802A1Substrate processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1362US2023207369A1Wafer chuck table and wafer chuck systemSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1461US2025379091A1Manufacturing method for semiconductor using warpage compensation wafer and manufacturing method for warpage compensation waferSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1561US2025021008A1Top module and exposing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1661US2025135448A1Catalyst scrubber apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1760US11626381B2Bonding head including a thermal compensator, die bonding apparatus including the same and method of manufacturing semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 11, 2023·0 cites·20 claims
- 1860US2024061982A1Pipe blockage prediction methodsSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1959US2025107190A1Semiconductor devices including substrate structureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2059US2025128215A1Gas mixerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2159US2025046727A1Wafer before semiconductor process and semiconductor chip manufacturing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2259US2024416529A1Robot bladeSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2359US2025369112A1Atomic layer deposition apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2457US2024071806A1Apparatus for heating waferSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2556US11698590B2Collector mirror and apparatus for creating extreme ultraviolet light including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 11, 2023·0 cites·20 claims
- 2654US2024424457A1Gas mixing device, substrate processing system including the same, and substrate processing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2752US2023037038A1Deposition apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2851US12170233B2Plasma treatment apparatus, a method of monitoring a process of manufacturing a semiconductor device by using the same, and a method of manufacturing a semiconductor device including the monitoring methodSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 17, 2024·0 cites·13 claims
- 2951US2024271282A1Source gas nozzle and semiconductor wafer processing apparatus including the sameSUMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3049US11720027B2Apparatus for generating extreme ultraviolet light and lithography apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 8, 2023·0 cites·18 claims
- 3149US2025076776A1Extreme ultraviolet (euv) source and a substrate processing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3248US2024215140A1Source vessel for euvSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3348US2023191547A1Apparatus and method for controlling chucking forceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3447US11304287B1Extreme ultraviolet light source systemsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 12, 2022·0 cites·20 claims
- 3546US2025081320A1Extreme ultraviolet light generating deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3645US11415891B2Extreme ultraviolet light source systemSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 16, 2022·0 cites·20 claims
- 3744US2024121877A1Extreme ultraviolet light source deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3843US10411062B2Substrate bonding apparatus having adsorption sectors with different vacuum pressures and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 10, 2019·0 cites·13 claims
- 3943US2019193238A1Wafer polishing pad and method of wafer polishing using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 4038US2021153332A1Droplet generator and extreme ultraviolet exposure device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 4128US2017110291A1Substrate treatment apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →