Inventor · disambiguated record
Sung-Ki Lee
Also filed as: LEE SUNG-KI
17 granted patents·12 pending applications·49 citations·filing 1997–2024
91Inventor score
Files withSAMSUNG ELECTRONICS CO LTD20FINETRO CO LTD2HYUNDAI MOTOR CO LTD2JEONG SE-YOUNG1KOREA INST GEOSCIENCE & MINERA1
Top patents by PatentIndex Score
29 records- 0194US10934621B2Gas injection module, substrate processing apparatus, and method of fabricating semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 2, 2021·14 cites·12 claims
- 0290US11974420B2Solid state drive apparatus including electrostatic prevention structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 30, 2024·2 cites·11 claims
- 0387US11061449B2Memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 13, 2021·2 cites·20 claims
- 0486US11856700B2Horizontally mounted capacitor module and electronic device including sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 26, 2023·3 cites·20 claims
- 0586US10678311B2Memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 9, 2020·4 cites·20 claims
- 0686US9894805B2Heat sink and memory module having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 13, 2018·5 cites·18 claims
- 0784US11576287B2Solid state drive apparatus including electrostatic prevention structureSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 7, 2023·5 cites·9 claims
- 0882US11056416B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 6, 2021·3 cites·16 claims
- 0971US10892145B2Substrate processing apparatus, substrate processing method, and method of fabricating semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 12, 2021·1 cites·18 claims
- 1068US11782489B2Memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 10, 2023·0 cites·6 claims
- 1166US11688661B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 27, 2023·0 cites·19 claims
- 1261US2025259866A1Device for removing void in underfill materialSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1360US12134369B2Console having multi-storage configurationHYUNDAI MOTOR CO LTD·Filed 2021·Granted Nov 5, 2024·0 cites·19 claims
- 1460US11384433B2Gas injection module, substrate processing apparatus, and method of fabricating semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 12, 2022·0 cites·20 claims
- 1554US2023140297A1Method for manufacturing brake padFINETRO CO LTD·Filed 2022·Application pending·0 cites
- 1653US9504160B2Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 22, 2016·2 cites·16 claims
- 1751US9122468B2Host apparatus connected to image forming apparatus and power save mode control method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 1, 2015·0 cites·17 claims
- 1851US2025380552A1Micro light-emitting device packageLC SQUARE CO LTD·Filed 2023·Application pending·0 cites
- 1950US2023016971A1Caliper unit for brakeFINETRO CO LTD·Filed 2022·Application pending·0 cites
- 2045US8516286B2Host apparatus connected to image forming apparatus and power save mode control method thereofLEE SUNG-KI·Filed 2008·Granted Aug 20, 2013·0 cites·17 claims
- 2145US2009057916A1Semiconductor package and apparatus using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2245US2008308913A1Stacked semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2345US2009026596A1Lead frame, semiconductor package, and stacked semiconductor package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2445US2015337569A1Device for opening and closing push open type fuel door for vehicleHYUNDAI MOTOR CO LTD·Filed 2014·Application pending·0 cites
- 2544US2010160151A1Method for manufacturing ammonia gas absorbent using Fe-zeoliteKOREA INST GEOSCIENCE & MINERA·Filed 2009·Application pending·0 cites
- 2638US2008073761A1Semiconductor package and stacked semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2736US6011603ADouble super twisted nematic liquid crystal display with improved pre-tilt anglesSAMSUNG DISPLAY DEVICES CO LTD·Filed 1997·Granted Jan 4, 2000·8 cites·6 claims
- 2835US2016019967A1External memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
- 2935US2006151878A1Semiconductor chip packaging apparatus and method of manufacturing semiconductor chip packageJEONG SE-YOUNG·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →