Inventor · disambiguated record
Sungyoon Lee
Also filed as: LEE SUNGYOON
8 granted patents·54 citations·filing 2007–2011
85Inventor score
Top patents by PatentIndex Score
8 records- 0192US7727875B2Grooving bumped wafer pre-underfill systemSTATS CHIPPAC LTD·Filed 2007·Granted Jun 1, 2010·21 cites·21 claims
- 0289US8030769B2Grooving bumped wafer pre-underfill systemSTATS CHIPPAC LTD·Filed 2010·Granted Oct 4, 2011·9 cites·25 claims
- 0378US7892072B2Method for directional grinding on backside of a semiconductor waferSTATS CHIPPAC LTD·Filed 2007·Granted Feb 22, 2011·7 cites·19 claims
- 0472US8704366B2Ultra thin bumped wafer with under-filmSHIN JUNGHOON·Filed 2010·Granted Apr 22, 2014·3 cites·27 claims
- 0571US9136144B2Method of forming protective material between semiconductor die stacked on semiconductor wafer to reduce defects during singulationLIM TAEGKI·Filed 2009·Granted Sep 15, 2015·10 cites·25 claims
- 0667US8329554B2Ultra thin bumped wafer with under-filmSHIN JUNGHOON·Filed 2010·Granted Dec 11, 2012·2 cites·17 claims
- 0764US7838391B2Ultra thin bumped wafer with under-filmSTATS CHIPPAC LTD·Filed 2007·Granted Nov 23, 2010·2 cites·20 claims
- 0844US8994196B2System and method for directional grinding on backside of a semiconductor waferLEE SUNGYOON·Filed 2011·Granted Mar 31, 2015·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →