Inventor · disambiguated record
Sung-Gue Lee
Also filed as: LEE SUNG-GUE
19 granted patents·6 pending applications·335 citations·filing 1999–2022
95Inventor score
Top patents by PatentIndex Score
25 records- 0193US7049178B2Method for fabricating semiconductor package and semiconductor packageLG ELECTRONICS INC·Filed 2003·Granted May 23, 2006·96 cites·29 claims
- 0287US7208341B2Method for manufacturing printed circuit boardLG ELECTRONICS INC·Filed 2004·Granted Apr 24, 2007·48 cites·7 claims
- 0381US7257891B2Method for forming bonding padsLG ELECTRONICS INC·Filed 2004·Granted Aug 21, 2007·18 cites·19 claims
- 0480US6706564B2Method for fabricating semiconductor package and semiconductor packageLG ELECTRONICS INC·Filed 2002·Granted Mar 16, 2004·28 cites·10 claims
- 0579US7304249B2Bonding pads for a printed circuit boardLG ELECTRONICS INC·Filed 2004·Granted Dec 4, 2007·17 cites·5 claims
- 0679US6740352B2Method for forming bonding padsLG ELECTRONICS INC·Filed 2002·Granted May 25, 2004·18 cites·9 claims
- 0771US6210518B1Method and fixture for manufacturing flexible printed circuit boardLG ELECTRONICS INC·Filed 1999·Granted Apr 3, 2001·31 cites·19 claims
- 0870US6954985B2Method for plugging holes in a printed circuit boardLG ELECTRONICS INC·Filed 2002·Granted Oct 18, 2005·14 cites·10 claims
- 0968US6509634B1Chip mounting structure having adhesive conductorLG ELECTRONICS INC·Filed 2000·Granted Jan 21, 2003·15 cites·25 claims
- 1063US8426739B2Printed circuit board and method for manufacturing the same, and panel for manufacturing the printed circuit boardLEE KWANG TAE·Filed 2008·Granted Apr 23, 2013·4 cites·8 claims
- 1161US6641983B1Method for forming exposed portion of circuit pattern in printed circuit boardLG ELECTRONICS INC·Filed 2000·Granted Nov 4, 2003·12 cites·2 claims
- 1260US2023210992A1Nanosatellite-substrate complex and method of regulating stem cell adhesion and differentiation using the sameUNIV KOREA RES & BUS FOUND·Filed 2022·Application pending·0 cites
- 1359US7320173B2Method for interconnecting multi-layer printed circuit boardLG ELECTRONICS INC·Filed 2004·Granted Jan 22, 2008·9 cites·8 claims
- 1458US6803257B2Printed circuit board with a heat dissipation element, method for manufacturing the printed circuit board, and package comprising the printed circuit boardLG ELECTRONICS INC·Filed 2002·Granted Oct 12, 2004·7 cites·22 claims
- 1555US6851184B2Method for manufacturing a printed circuit boardLG ELECTRONICS INC·Filed 2002·Granted Feb 8, 2005·7 cites·24 claims
- 1655US2023330005A1Self-assembled complex containing calcium ionUNIV KOREA RES & BUS FOUND·Filed 2022·Application pending·0 cites
- 1753US7098533B2Printed circuit board with a heat dissipation element and package comprising the printed circuit boardLG ELECTRONICS INC·Filed 2004·Granted Aug 29, 2006·4 cites·13 claims
- 1853US2023330232A1Self-assembled complex containing iron ionUNIV KOREA RES & BUS FOUND·Filed 2022·Application pending·0 cites
- 1953US2023241214A1Light-controllable self-assembled complex and nanosystem including the sameUNIV KOREA RES & BUS FOUND·Filed 2022·Application pending·0 cites
- 2052US7189302B2Multi-layer printed circuit board and fabricating method thereofLG ELECTRONICS INC·Filed 2004·Granted Mar 13, 2007·5 cites·5 claims
- 2145US6849294B2Method for fabricating circuit pattern of printed circuit boardLG ELECTRONICS INC·Filed 2003·Granted Feb 1, 2005·1 cites·19 claims
- 2244US7337535B2Hole plugging method for printed circuit boards, and hole plugging deviceLG ELECTRONICS INC·Filed 2004·Granted Mar 4, 2008·1 cites·18 claims
- 2338US2004050708A1Plating method for PCBLG ELECTRONICS INC·Filed 2003·Application pending·0 cites
- 2435US2019371949A1Solar cell and a method for manufacturing a solar cellSOFTPV INC·Filed 2019·Application pending·0 cites
- 2524US9666733B2Solar cell using printed circuit boardAHN HYEON WOO·Filed 2013·Granted May 30, 2017·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →