Inventor · disambiguated record
Sun-Hye Lee
Also filed as: LEE SUN HYE
7 granted patents·3 pending applications·80 citations·filing 2009–2020
82Inventor score
Files withKIM TAE HUN3SAMSUNG ELECTRONICS CO LTD3KIM SANG-UK1PARK BUM JOON1PUSAN NAT UNIV INDUSTRY-UNIV COOP FOUND1
Top patents by PatentIndex Score
10 records- 0197US8293580B2Method of forming package-on-package and device related theretoKIM TAE-HUN·Filed 2011·Granted Oct 23, 2012·63 cites·12 claims
- 0286US8653640B2Semiconductor package apparatusKIM TAE-HUN·Filed 2012·Granted Feb 18, 2014·11 cites·20 claims
- 0372US8970025B2Stacked packages having through hole viasSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 3, 2015·2 cites·9 claims
- 0471US8754515B2Stacked packages having through hole viasKIM TAE-HUN·Filed 2012·Granted Jun 17, 2014·2 cites·13 claims
- 0568US9184407B2Organic light emitting device having stacked electron transport layersSAMSUNG DISPLAY CO LTD·Filed 2014·Granted Nov 10, 2015·2 cites·11 claims
- 0653US11728409B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 15, 2023·0 cites·20 claims
- 0753US9400281B2Method of screening of therapeutic agents for K-Ras mutant driven cancersPUSAN NAT UNIV INDUSTRY-UNIV COOP FOUND·Filed 2013·Granted Jul 26, 2016·0 cites·2 claims
- 0852US2012015960A1Chemical inhibitor of p53-snail binding and pharmaceutical composition for treating cancer disease containing same as its active ingredientPARK BUM JOON·Filed 2009·Application pending·0 cites
- 0939US2013241044A1Semiconductor package having protective layer and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
- 1037US2011291294A1Multi-Chip PackageKIM SANG-UK·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →