Inventor · disambiguated record
Sung Jae Lim
Also filed as: LIM SUNG-JAE
3 granted patents·1 pending application·3 citations·filing 2013–2022
56Inventor score
Top patents by PatentIndex Score
4 records- 0188US11355452B2EMI shielding for flip chip package with exposed die backsideSTATS CHIPPAC PTE LTD·Filed 2020·Granted Jun 7, 2022·2 cites·24 claims
- 0270US11688697B2Emi shielding for flip chip package with exposed die backsideSTATS CHIPPAC PTE LTD·Filed 2022·Granted Jun 27, 2023·0 cites·21 claims
- 0355US9244119B2Apparatus for testing a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 26, 2016·1 cites·15 claims
- 0442US2017004485A1Method for payment using short range communication and electronic device thereforSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →