Inventor · disambiguated record
Sung-Kun Lin
Also filed as: LIN SUNG-KUN
0 granted patents·10 pending applications·0 citations·filing 2023–2025
Files withAALTOSEMI INC10
Top patents by PatentIndex Score
10 records- 0157US2025159800A1Package substrate and manufacturing method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 0252US2025096105A1Package substrate and fabricating method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 0352US2025192014A1Electronic package and manufacturing method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 0450US2025323062A1Fabricating method of package substrateAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 0550US2024096776A1Package substrateAALTOSEMI INC·Filed 2023·Application pending·0 cites
- 0648US2023298986A1Package substrate and manufacturing method thereofAALTOSEMI INC·Filed 2023·Application pending·0 cites
- 0746US2025308935A1Method for fabricating a package substrateAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 0846US2025372400A1Fabricating method of package substrateAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 0943US2025300052A1Semiconductor package and fabricating method thereofAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 1042US2025246443A1Package substrate and manufacturing method thereofAALTOSEMI INC·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →