Inventor · disambiguated record
Sunao Masuda
Also filed as: MASUDA SUNAO
34 granted patents·1 pending application·325 citations·filing 1999–2020
96Inventor score
Top patents by PatentIndex Score
35 records- 0197US7050288B2Laminated ceramic capacitorTDK CORP·Filed 2005·Granted May 23, 2006·65 cites·10 claims
- 0295US6124769AElectronic device, and its fabrication methodTDK CORP·Filed 1999·Granted Sep 26, 2000·110 cites·25 claims
- 0393US9613753B2Electronic device comprising chip component and external terminalTDK CORP·Filed 2014·Granted Apr 4, 2017·12 cites·34 claims
- 0493US8562229B2Printing apparatus with cutter having a blade including a step portionINABA TAKEHIKO·Filed 2008·Granted Oct 22, 2013·24 cites·4 claims
- 0592US9042079B2Ceramic electronic componentTDK CORP·Filed 2013·Granted May 26, 2015·12 cites·21 claims
- 0691US10381157B2Ceramic electronic deviceTDK CORP·Filed 2018·Granted Aug 13, 2019·5 cites·6 claims
- 0790US10242805B2Electronic device with external terminalTDK CORP·Filed 2017·Granted Mar 26, 2019·4 cites·11 claims
- 0890US6452781B1Multilayer electronic deviceTDK CORP·Filed 2001·Granted Sep 17, 2002·56 cites·8 claims
- 0988US10381158B2Electronic deviceTDK CORP·Filed 2017·Granted Aug 13, 2019·3 cites·7 claims
- 1085US9105405B2Ceramic electronic component with metal terminalsTDK CORP·Filed 2013·Granted Aug 11, 2015·5 cites·12 claims
- 1185US8315035B2Multilayer capacitor and method of manufacturing sameTOGASHI MASAAKI·Filed 2009·Granted Nov 20, 2012·13 cites·18 claims
- 1284US10559426B2Electronic device having ceramic element body and external terminalTDK CORP·Filed 2018·Granted Feb 11, 2020·2 cites·13 claims
- 1382US10096426B2Electronic deviceTDK CORP·Filed 2016·Granted Oct 9, 2018·2 cites·7 claims
- 1478US10102971B2Multilayer capacitor with an overcurrent protection deviceTDK CORP·Filed 2016·Granted Oct 16, 2018·2 cites·17 claims
- 1578US9881742B2Electronic componentTDK CORP·Filed 2016·Granted Jan 30, 2018·2 cites·9 claims
- 1675US9640321B2Ceramic electronic component with metal terminalTDK CORP·Filed 2014·Granted May 2, 2017·2 cites·23 claims
- 1773US10804035B2Ceramic electronic deviceTDK CORP·Filed 2017·Granted Oct 13, 2020·1 cites·7 claims
- 1873US9916929B2Electronic componentTDK CORP·Filed 2016·Granted Mar 13, 2018·2 cites·4 claims
- 1966US11302473B2Electronic deviceTDK CORP·Filed 2019·Granted Apr 12, 2022·0 cites·16 claims
- 2066US10984950B2Method of manufacturing electronic device and the sameTDK CORP·Filed 2020·Granted Apr 20, 2021·0 cites·8 claims
- 2165US10777353B2Method of manufacturing electronic device and the sameTDK CORP·Filed 2018·Granted Sep 15, 2020·0 cites·8 claims
- 2262US7391219B2Chip type electronic component for test, and mounted state test methodTDK CORP·Filed 2007·Granted Jun 24, 2008·3 cites·3 claims
- 2361US10984953B2Electronic device assemblyTDK CORP·Filed 2019·Granted Apr 20, 2021·0 cites·16 claims
- 2460US10916375B2Electronic deviceTDK CORP·Filed 2019·Granted Feb 9, 2021·0 cites·21 claims
- 2560US10790088B2Electronic deviceTDK CORP·Filed 2019·Granted Sep 29, 2020·0 cites·14 claims
- 2657US10796854B2Electronic deviceTDK CORP·Filed 2019·Granted Oct 6, 2020·0 cites·9 claims
- 2756US10566139B2Ceramic electronic deviceTDK CORP·Filed 2018·Granted Feb 18, 2020·0 cites·4 claims
- 2853US10763043B2Electronic deviceTDK CORP·Filed 2018·Granted Sep 1, 2020·0 cites·19 claims
- 2952US10714264B2Electronic deviceTDK CORP·Filed 2018·Granted Jul 14, 2020·0 cites·15 claims
- 3051US11081275B2Electronic deviceTDK CORP·Filed 2019·Granted Aug 3, 2021·0 cites·19 claims
- 3151US10818432B2Electronic deviceTDK CORP·Filed 2018·Granted Oct 27, 2020·0 cites·7 claims
- 3245US10763045B2Electronic deviceTDK CORP·Filed 2017·Granted Sep 1, 2020·0 cites·11 claims
- 3345US10276305B2Ceramic electronic deviceTDK CORP·Filed 2017·Granted Apr 30, 2019·0 cites·6 claims
- 3443US10607778B2Ceramic electronic deviceTDK CORP·Filed 2017·Granted Mar 31, 2020·0 cites·17 claims
- 3536US2003011963A1Multiterminal multilayer ceramic electronic deviceTDK CORP·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →