Inventor · disambiguated record
Sutapa Mukherjee
Also filed as: MUKHERJEE SUTAPA
9 granted patents·5 pending applications·15 citations·filing 2013–2023
82Inventor score
Top patents by PatentIndex Score
14 records- 0188US11162007B2Sintering pasteALPHA ASSEMBLY SOLUTIONS INC·Filed 2019·Granted Nov 2, 2021·3 cites·20 claims
- 0285US10259980B2Sintering powderALPHA ASSEMBLY SOLUTIONS INC·Filed 2013·Granted Apr 16, 2019·5 cites·8 claims
- 0382US10130995B2Method for manufacturing metal powderALPHA ASSEMBLY SOLUTIONS INC·Filed 2015·Granted Nov 20, 2018·2 cites·12 claims
- 0477US2023330788A1Lead-free and antimony-free tin solder reliable at high temperaturesALPHA ASSEMBLY SOLUTIONS INC·Filed 2023·Application pending·0 cites
- 0575US10322471B2Low temperature high reliability alloy for solder hierarchyALPHA ASSEMBLY SOLUTIONS INC·Filed 2015·Granted Jun 18, 2019·3 cites·21 claims
- 0662US10894302B2Multilayered metal nano and micron particlesALPHA ASSEMBLY SOLUTIONS INC·Filed 2015·Granted Jan 19, 2021·1 cites·15 claims
- 0757US11389865B2Sintering materials and attachment methods using sameALPHA ASSEMBLY SOLUTIONS INC·Filed 2015·Granted Jul 19, 2022·1 cites·23 claims
- 0857US2021205935A1Multilayered metal nano and micron particlesALPHA ASSEMBLY SOLUTIONS INC·Filed 2021·Application pending·0 cites
- 0957US2015266137A1Lead-free and antimony-free tin solder reliable at high temperaturesALPHA METALS·Filed 2013·Application pending·0 cites
- 1053US11090768B2Lead-free and antimony-free tin solder reliable at high temperaturesALPHA ASSEMBLY SOLUTIONS INC·Filed 2015·Granted Aug 17, 2021·0 cites·16 claims
- 1153US2016023309A1Lead-free and antimony-free tin solder reliable at high temperaturesALPHA METALS·Filed 2015·Application pending·0 cites
- 1242US9786629B2Dual-side reinforcement flux for encapsulationALPHA ASSEMBLY SOLUTIONS INC·Filed 2014·Granted Oct 10, 2017·0 cites·9 claims
- 1333US10682732B2Engineered polymer-based electronic materialsALPHA ASSEMBLY SOLUTIONS INC·Filed 2016·Granted Jun 16, 2020·0 cites·18 claims
- 1432US2017135227A1Engineered Residue Solder Paste TechnologyALPHA METALS·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →