Inventor · disambiguated record
Sungho Mun
Also filed as: MUN SUNGHO
0 granted patents·3 pending applications·0 citations·filing 2023–2024
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD3
Top patents by PatentIndex Score
3 records- 0163US2025140695A1Semiconductor package with a backside power distribution networkSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0258US2024321681A1Heat dissipation structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0356US2024055339A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →