Inventor · disambiguated record
Sung Lae Oh
Also filed as: OH SUNG EUN · OH SUNG LAE
119 granted patents·17 pending applications·373 citations·filing 2001–2025
99Inventor score
Top patents by PatentIndex Score
136 records- 0197US11387154B2Memory device, memory system including the same and methods of operationSK HYNIX INC·Filed 2020·Granted Jul 12, 2022·5 cites·20 claims
- 0297US11315639B2Memory device having vertical structureSK HYNIX INC·Filed 2020·Granted Apr 26, 2022·5 cites·27 claims
- 0397US11183246B1Memory deviceSK HYNIX INC·Filed 2020·Granted Nov 23, 2021·6 cites·20 claims
- 0497US10896918B1Semiconductor memory device and manufacturing method thereofSK HYNIX INC·Filed 2019·Granted Jan 19, 2021·16 cites·17 claims
- 0597US9653562B2Nonvolatile memory device and method for manufacturing the sameSK HYNIX INC·Filed 2016·Granted May 16, 2017·25 cites·21 claims
- 0696US11239209B2Memory device, memory system having the same, and write method thereofSK HYNIX INC·Filed 2020·Granted Feb 1, 2022·3 cites·20 claims
- 0796US10141326B1Semiconductor memory deviceSK HYNIX INC·Filed 2018·Granted Nov 27, 2018·63 cites·20 claims
- 0896US9515084B23D nonvolatile memory device having common word lineSK HYNIX INC·Filed 2015·Granted Dec 6, 2016·16 cites·12 claims
- 0996US9460793B1Semiconductor memory deviceSK HYNIX INC·Filed 2015·Granted Oct 4, 2016·24 cites·20 claims
- 1095US12424575B2Three-dimensional semiconductor deviceSK HYNIX INC·Filed 2022·Granted Sep 23, 2025·2 cites·18 claims
- 1193US9837433B2Semiconductor memory device including 3-dimensional structure and method for manufacturing the sameSK HYNIX INC·Filed 2016·Granted Dec 5, 2017·10 cites·9 claims
- 1292US11742288B2Three-dimensional memory device and manufacturing method thereofSK HYNIX INC·Filed 2021·Granted Aug 29, 2023·2 cites·10 claims
- 1392US11211328B2Semiconductor memory device of three-dimensional structureSK HYNIX INC·Filed 2020·Granted Dec 28, 2021·3 cites·21 claims
- 1492US11177005B2Semiconductor memory device having plurality of memory chipsSK HYNIX INC·Filed 2020·Granted Nov 16, 2021·3 cites·18 claims
- 1592US10388663B2Wiring line structure of three-dimensional memory deviceSK HYNIX INC·Filed 2018·Granted Aug 20, 2019·8 cites·14 claims
- 1692US10062765B2Nonvolatile memory device including multiple planesSK HYNIX INC·Filed 2017·Granted Aug 28, 2018·10 cites·20 claims
- 1792US9761602B2Semiconductor memory deviceSK HYNIX INC·Filed 2015·Granted Sep 12, 2017·9 cites·17 claims
- 1892US9419009B13D nonvolatile memory deviceSK HYNIX INC·Filed 2015·Granted Aug 16, 2016·9 cites·7 claims
- 1992US9165774B2Semiconductor device and method of manufacturing the sameSK HYNIX INC·Filed 2014·Granted Oct 20, 2015·12 cites·11 claims
- 2091US10546814B2Three dimensional semiconductor memory device having peripheral circuit under cell structureSK HYNIX INC·Filed 2016·Granted Jan 28, 2020·11 cites·15 claims
- 2190US12101930B2Memory device having vertical structureSK HYNIX INC·Filed 2022·Granted Sep 24, 2024·1 cites·5 claims
- 2290US9837419B23D semiconductor device with reduced chip sizeSK HYNIX INC·Filed 2015·Granted Dec 5, 2017·8 cites·19 claims
- 2389US11315895B2Semiconductor memory device having wafer-to-wafer bonding structureSK HYNIX INC·Filed 2020·Granted Apr 26, 2022·2 cites·19 claims
- 2488US11342353B2Semiconductor memory device having three-dimensional structure and method for manufacturing the sameSK HYNIX INC·Filed 2020·Granted May 24, 2022·2 cites·14 claims
- 2588US9230981B2Semiconductor deviceSK HYNIX INC·Filed 2014·Granted Jan 5, 2016·10 cites·14 claims
- 2687US11380702B2Memory device having vertical structureSK HYNIX INC·Filed 2021·Granted Jul 5, 2022·2 cites·15 claims
- 2787US10971487B2Semiconductor memory deviceSK HYNIX INC·Filed 2020·Granted Apr 6, 2021·2 cites·20 claims
- 2887US9263368B2Semiconductor device and method of manufacturing the sameSK HYNIX INC·Filed 2014·Granted Feb 16, 2016·8 cites·20 claims
- 2986US11176989B2Semiconductor memory device having page buffer high-voltage circuitSK HYNIX INC·Filed 2020·Granted Nov 16, 2021·2 cites·20 claims
- 3086US9324732B2Three-dimensional (3D) non-volatile memory deviceSK HYNIX INC·Filed 2015·Granted Apr 26, 2016·5 cites·12 claims
- 3185US11488672B2Semiconductor memory device including page buffersSK HYNIX INC·Filed 2020·Granted Nov 1, 2022·1 cites·18 claims
- 3285US10566343B2Semiconductor memory device including 3-dimensional structure and method for manufacturing the sameSK HYNIX INC·Filed 2017·Granted Feb 18, 2020·4 cites·7 claims
- 3385US9171859B2Semiconductor device and method of manufacturing the sameSK HYNIX INC·Filed 2014·Granted Oct 27, 2015·7 cites·15 claims
- 3484US11961552B2Memory device including partial pages in memory blocksSK HYNIX INC·Filed 2022·Granted Apr 16, 2024·1 cites·19 claims
- 3584US11398443B2Memory device having logic circuit distributed across two peripheral waferSK HYNIX INC·Filed 2021·Granted Jul 26, 2022·1 cites·20 claims
- 3683US11538820B2Memory device having vertical structure including a first wafer and a second wafer stacked on the first waferSK HYNIX INC·Filed 2020·Granted Dec 27, 2022·1 cites·19 claims
- 3782US11367504B2Semiconductor memory device and partial rescue method thereofSK HYNIX INC·Filed 2021·Granted Jun 21, 2022·1 cites·7 claims
- 3882US11114152B1Semiconductor memory device including page buffersSK HYNIX INC·Filed 2020·Granted Sep 7, 2021·1 cites·20 claims
- 3982US10937804B2Semiconductor memory deviceSK HYNIX INC·Filed 2019·Granted Mar 2, 2021·2 cites·7 claims
- 4082US10573659B2Semiconductor memory device of three-dimensional structureSK HYNIX INC·Filed 2018·Granted Feb 25, 2020·5 cites·19 claims
- 4182US9064724B2Three-dimensional non-volatile memory device with stacked-structure memory blocksSK HYNIX INC·Filed 2013·Granted Jun 23, 2015·6 cites·18 claims
- 4282US2025374563A1Three-dimensional semiconductor deviceSK HYNIX INC·Filed 2025·Application pending·0 cites
- 4381US11195852B2Semiconductor memory device having wiring line structureSK HYNIX INC·Filed 2019·Granted Dec 7, 2021·3 cites·20 claims
- 4481US10319416B2Memory device including page buffersSK HYNIX INC·Filed 2017·Granted Jun 11, 2019·5 cites·20 claims
- 4581US9965388B2Memory device including page buffer and method of arranging page buffer having cache latchesSK HYNIX INC·Filed 2017·Granted May 8, 2018·5 cites·16 claims
- 4680US11374016B2Semiconductor memory device with chip-to-chip bonding structureSK HYNIX INC·Filed 2020·Granted Jun 28, 2022·1 cites·19 claims
- 4780US11101002B2Semiconductor memory device including cache latch circuitSK HYNIX INC·Filed 2020·Granted Aug 24, 2021·1 cites·17 claims
- 4880US10664395B2Memory device including page buffersSK HYNIX INC·Filed 2018·Granted May 26, 2020·4 cites·19 claims
- 4980US2024429163A1Semiconductor deviceSK HYNIX INC·Filed 2024·Application pending·0 cites
- 5079US12113018B2Semiconductor deviceSK HYNIX INC·Filed 2023·Granted Oct 8, 2024·0 cites·10 claims
Showing the top 50 of 136 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Sung Lae Oh files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →