Inventor · disambiguated record
Sumio Okada
Also filed as: OKADA SUMIO
6 granted patents·479 citations·filing 1988–2017
83Inventor score
Top patents by PatentIndex Score
6 records- 0196US4920074ASurface mount plastic package semiconductor integrated circuit, manufacturing method thereof, as well as mounting method and mounted structure thereofHITACHI LTD·Filed 1988·Granted Apr 24, 1990·316 cites·15 claims
- 0285US5150193AResin-encapsulated semiconductor device having a particular mounting structureHITACHI LTD·Filed 1991·Granted Sep 22, 1992·107 cites·28 claims
- 0374US5304512AProcess for manufacturing semiconductor integrated circuit device, and molding apparatus and molding material for the processHITACHI LTD·Filed 1992·Granted Apr 19, 1994·56 cites·61 claims
- 0441US11213757B2Information processing apparatus, information processing method, and programSONY CORP·Filed 2017·Granted Jan 4, 2022·0 cites·16 claims
- 0537US11146863B2Information processing device, information processing method, and moving image distribution systemSONY CORP·Filed 2017·Granted Oct 12, 2021·0 cites·15 claims
- 0635US9652598B2Information processing device, control method, and storage mediumSONY CORP·Filed 2015·Granted May 16, 2017·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →