Inventor · disambiguated record
Subyung Park
Also filed as: PARK SUBYUNG
1 granted patent·2 pending applications·0 citations·filing 2020–2021
11Inventor score
Technology areasH05K
Files withDOOSAN CORP3
Top patents by PatentIndex Score
3 records- 0152US12410347B2Adhesive composition, and coverlay film and printed circuit board that include the sameDOOSAN CORP·Filed 2021·Granted Sep 9, 2025·0 cites·18 claims
- 0239US2023309222A1Method for manufacturing flexible printed circuit board and flexible printed circuit board manufactured by sameDOOSAN CORP·Filed 2021·Application pending·0 cites
- 0334US2022251433A1Adhesive composition, coverlay film comprising same, and printed circuit boardDOOSAN CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →