Inventor · disambiguated record
Sung Gyu Pyo
Also filed as: PYO SUNG G · PYO SUNG GYU
27 granted patents·8 pending applications·290 citations·filing 1999–2013
96Inventor score
Files withHYNIX SEMICONDUCTOR INC12HYUNDAI ELECTRONICS IND7MAGNACHIP SEMICONDUCTOR LTD4PYO SUNG-GYU3CROSSTEK CAPITAL LLC1
Top patents by PatentIndex Score
35 records- 0188US8212328B2Backside illuminated image sensorPYO SUNG-GYU·Filed 2008·Granted Jul 3, 2012·16 cites·22 claims
- 0286US8564135B2Backside illuminated sensor and manufacturing method thereofPYO SUNG-GYU·Filed 2009·Granted Oct 22, 2013·13 cites·12 claims
- 0386US6413864B1Method of manufacturing a copper metal wiring in a semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2001·Granted Jul 2, 2002·44 cites·19 claims
- 0483US7948043B2MEMS package that includes MEMS device wafer bonded to cap wafer and exposed array padsMAGNACHIP SEMICONDUCTOR LTD·Filed 2009·Granted May 24, 2011·7 cites·17 claims
- 0579US8969194B2Backside illuminated image sensor and manufacturing method thereofINTELLECTUAL VENTURES II LLC·Filed 2013·Granted Mar 3, 2015·4 cites·19 claims
- 0679US6492268B1Method of forming a copper wiring in a semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 2000·Granted Dec 10, 2002·22 cites·55 claims
- 0778US7557441B2Package of MEMS device and method for fabricating the sameMAGNACHIP SEMICONDUCTOR LTD·Filed 2007·Granted Jul 7, 2009·5 cites·14 claims
- 0878US6849298B2Method for forming diffusion barrier film of semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2002·Granted Feb 1, 2005·21 cites·20 claims
- 0978US6846364B2Heater block having catalyst spray meansHYNIX SEMICONDUCTOR INC·Filed 2001·Granted Jan 25, 2005·16 cites·8 claims
- 1075US6593236B2Method of forming a metal wiring in a semiconductor device with copper seedHYNIX SEMICONDUCTOR INC·Filed 2001·Granted Jul 15, 2003·18 cites·14 claims
- 1172US7615394B2Method for fabricating MEMS device package that includes grinding MEMS device wafer to expose array pads corresponding to a cap waferMAGNACHIP SEMICONDUCTOR LTD·Filed 2007·Granted Nov 10, 2009·3 cites·14 claims
- 1270US6349887B1Liquid delivery systemHYUNDAI ELECTRONICS IND·Filed 1999·Granted Feb 26, 2002·38 cites·12 claims
- 1369US8772072B2Backside illuminated image sensorPYO SUNG-GYU·Filed 2012·Granted Jul 8, 2014·2 cites·20 claims
- 1465US8357560B2Package of MEMS device and method for fabricating the sameMAGNACHIP SEMICONDUCTOR LTD·Filed 2009·Granted Jan 22, 2013·1 cites·18 claims
- 1564US7041566B2Method for forming inductor in semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2004·Granted May 9, 2006·11 cites·10 claims
- 1664US6337276B1Methods of forming a copper wiring in a semiconductor device using chemical vapor depositionHYUNDAI ELECTRONICS IND·Filed 2000·Granted Jan 8, 2002·9 cites·75 claims
- 1763US6645858B2Method of catalyzing copper deposition in a damascene structure by plasma treating the barrier layer and then applying a catalyst such as iodine or iodine compounds to the barrier layerHYUNDAI ELECTRONICS IND·Filed 2001·Granted Nov 11, 2003·9 cites·24 claims
- 1863US6436826B1Method of forming a metal wiring in a semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2001·Granted Aug 20, 2002·11 cites·17 claims
- 1962US6468907B2Method of manufacturing a copper wiring in a semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2001·Granted Oct 22, 2002·8 cites·28 claims
- 2061US6346478B1Method of forming a copper wiring in a semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 2000·Granted Feb 12, 2002·8 cites·81 claims
- 2157US7037800B2Radio frequency semiconductor device and method of manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2004·Granted May 2, 2006·7 cites·11 claims
- 2256US6627523B2Method of forming a metal wiring in a semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2001·Granted Sep 30, 2003·7 cites·8 claims
- 2356US6551932B2Method for forming metal line in a semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2001·Granted Apr 22, 2003·5 cites·22 claims
- 2452US6528415B2Method of forming a metal line in a semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2001·Granted Mar 4, 2003·3 cites·11 claims
- 2552US2005253176A1Chip scale image sensor and method for fabricating the samePYO SUNG G·Filed 2005·Application pending·0 cites
- 2647US6617238B2Method of manufacturing a metal wiring in a semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 2002·Granted Sep 9, 2003·1 cites·17 claims
- 2747US2011180895A1Method of manufacturing a cmos image sensorCROSSTEK CAPITAL LLC·Filed 2009·Application pending·0 cites
- 2844US6723645B2Method of forming a metal wiring in a semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2001·Granted Apr 20, 2004·1 cites·11 claims
- 2941US6376356B2Method of manufacturing a metal wiring in a semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 2001·Granted Apr 23, 2002·0 cites·18 claims
- 3041US2003000469A1Chemical enhancer treatment chamber and a Cu, thin film deposition apparatus of a semiconductor device using the sameFiled 2002·Application pending·0 cites
- 3140US2002017243A1Showerhead in chemical-enhanced chemical vapor deposition equipmentFiled 2001·Application pending·0 cites
- 3240US2001053587A1Apparatus for supplying a liquid raw material and method of manufacturing a copper layer using the sameFiled 2001·Application pending·0 cites
- 3337US2005014317A1Method for forming inductor in semiconductor deviceFiled 2003·Application pending·0 cites
- 3436US2002020767A1Showerhead and liquid raw material supply apparatus using the sameFiled 2001·Application pending·0 cites
- 3536US2002025671A1Method of manufacturing a metal line in a semiconductor deviceFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →