Inventor · disambiguated record
Suresh Ramarajan
Also filed as: RAMARAJAN SURESH
22 granted patents·3 pending applications·162 citations·filing 2000–2024
95Inventor score
Top patents by PatentIndex Score
25 records- 0195US11088017B2Stair step structures including insulative materials, and related devicesMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 10, 2021·4 cites·17 claims
- 0295US10269625B1Methods of forming semiconductor structures having stair step structuresMICRON TECHNOLOGY INC·Filed 2017·Granted Apr 23, 2019·39 cites·7 claims
- 0391US9680089B1Magnetic tunnel junctionsMICRON TECHNOLOGY INC·Filed 2016·Granted Jun 13, 2017·9 cites·24 claims
- 0489US10600682B2Semiconductor devices including a stair step structure, and related methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Mar 24, 2020·6 cites·20 claims
- 0589US9593431B2Electroplating systemsMICRON TECHNOLOGY INC·Filed 2013·Granted Mar 14, 2017·6 cites·12 claims
- 0686US11101171B2Apparatus comprising structures including contact vias and conductive lines, related methods, and memory devicesMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 24, 2021·4 cites·28 claims
- 0785US7997958B2Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpiecesMICRON TECHNOLOGY INC·Filed 2010·Granted Aug 16, 2011·4 cites·13 claims
- 0885US6702954B1Chemical-mechanical polishing slurry and methodFERRO CORP·Filed 2000·Granted Mar 9, 2004·32 cites·17 claims
- 0984US10439131B2Methods of forming semiconductor devices including tunnel barrier materialsMICRON TECHNOLOGY INC·Filed 2015·Granted Oct 8, 2019·7 cites·19 claims
- 1083US7708622B2Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpiecesMICRON TECHNOLOGY INC·Filed 2005·Granted May 4, 2010·7 cites·21 claims
- 1176US7708875B2Noncontact localized electrochemical deposition of metal thin filmsMICRON TECHNOLOGY INC·Filed 2006·Granted May 4, 2010·3 cites·16 claims
- 1276US2024266214A1Apparatuses and memory devices including conductive lines and interconnect structuresLODESTAR LICENSING GROUP LLC·Filed 2024·Application pending·0 cites
- 1375US7435324B2Noncontact localized electrochemical deposition of metal thin filmsMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 14, 2008·12 cites·19 claims
- 1470US11990367B2Apparatus and memory device including conductive lines and contacts, and methods of forming an apparatus including conductive lines and contactsMICRON TECHNOLOGY INC·Filed 2021·Granted May 21, 2024·0 cites·20 claims
- 1569US7101800B2Chemical-mechanical polishing slurry and methodFERRO CORP·Filed 2003·Granted Sep 5, 2006·11 cites·19 claims
- 1667US7176676B2Apparatuses and methods for monitoring rotation of a conductive microfeature workpieceMICRON TECHNOLOGY INC·Filed 2006·Granted Feb 13, 2007·4 cites·41 claims
- 1765US8419906B2Electroplating systemsRAMARAJAN SURESH·Filed 2008·Granted Apr 16, 2013·2 cites·17 claims
- 1865US6884152B2Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpiecesMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 26, 2005·7 cites·26 claims
- 1955US7030603B2Apparatuses and methods for monitoring rotation of a conductive microfeature workpieceMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 18, 2006·5 cites·51 claims
- 2052US10374149B2Magnetic tunnel junctionsMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 6, 2019·0 cites·2 claims
- 2150US10720569B2Magnetic tunnel junctionsMICRON TECHNOLOGY INC·Filed 2019·Granted Jul 21, 2020·0 cites·6 claims
- 2250US10062835B2Magnetic tunnel junctionsMICRON TECHNOLOGY INC·Filed 2017·Granted Aug 28, 2018·0 cites·9 claims
- 2350US2011300782A1Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpiecesRAMARAJAN SURESH·Filed 2011·Application pending·0 cites
- 2448US7453152B2Device having reduced chemical mechanical planarizationMICRON TECHNOLOGY INC·Filed 2006·Granted Nov 18, 2008·0 cites·15 claims
- 2541US2005139292A1Method and apparatus for minimizing thickness-to-planarity and dishing in CMPFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →