Inventor · disambiguated record
Sudipto Ranendra Roy
Also filed as: RANENDRA ROY SUDIPTO · ROY RANENDRA SUDIPTO · ROY SUDIPTO R · ROY SUDIPTO RANENDRA
35 granted patents·2 pending applications·728 citations·filing 1992–2004
98Inventor score
Top patents by PatentIndex Score
37 records- 0194US6683002B1Method to create a copper diffusion deterrent interfaceCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Jan 27, 2004·71 cites·7 claims
- 0289US6004188AMethod for forming copper damascene structures by using a dual CMP barrier layerCHARTERED SEMICONDUCTOR MFG·Filed 1998·Granted Dec 21, 1999·101 cites·16 claims
- 0386US6417088B1Method of application of displacement reaction to form a conductive cap layer for flip-chip, COB, and micro metal bondingCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Jul 9, 2002·44 cites·22 claims
- 0486US6378759B1Method of application of conductive cap-layer in flip-chip, COB, and micro metal bondingCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Apr 30, 2002·37 cites·17 claims
- 0584US6720204B2Method of using hydrogen plasma to pre-clean copper surfaces during Cu/Cu or Cu/metal bondingCHARTERED SEMICONDUCTOR MFG·Filed 2002·Granted Apr 13, 2004·38 cites·18 claims
- 0683US5996594APost-chemical mechanical planarization clean-up process using post-polish scrubbingTEXAS INSTRUMENTS INC·Filed 1996·Granted Dec 7, 1999·86 cites·29 claims
- 0780US6521079B1Linear CMP tool design with closed loop slurry distributionCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Feb 18, 2003·18 cites·13 claims
- 0880US6475810B1Method of manufacturing embedded organic stop layer for dual damascene patterningCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Nov 5, 2002·24 cites·24 claims
- 0978US6540841B1Method and apparatus for removing contaminants from the perimeter of a semiconductor substrateCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Apr 1, 2003·13 cites·12 claims
- 1078US6429117B1Method to create copper traps by modifying treatment on the dielectrics surfaceCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Aug 6, 2002·21 cites·34 claims
- 1174US6340608B1Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper padsCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Jan 22, 2002·21 cites·11 claims
- 1274US6150269ACopper interconnect patterningCHARTERED SEMICONDUCTOR MFG CO·Filed 1998·Granted Nov 21, 2000·46 cites·21 claims
- 1373US6547652B1Linear CMP tool design using in-situ slurry distribution and concurrent pad conditioningCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Apr 15, 2003·13 cites·15 claims
- 1472US6350689B1Method to remove copper contamination by using downstream oxygen and chelating agent plasmaCHARTERED SEMICONDUCTOR MFG·Filed 2001·Granted Feb 26, 2002·15 cites·40 claims
- 1566US6017780APassivation scheme for LCD and other applicationsCHARTERED SEMICONDUCTOR MFG·Filed 1998·Granted Jan 25, 2000·31 cites·26 claims
- 1665US6705512B2Method of application of conductive cap-layer in flip-chip, cob, and micro metal bondingCHARTERED SEMICONDUCTOR MFG·Filed 2002·Granted Mar 16, 2004·10 cites·17 claims
- 1765US6572731B1Self-siphoning CMP tool design for applications such as copper CMP and low-k dielectric CMPCHARTERED SEMICONDUCTOR MFG·Filed 2002·Granted Jun 3, 2003·9 cites·29 claims
- 1863US6813796B2Apparatus and methods to clean copper contamination on wafer edgeCHARTERED SEMICONDUCTOR MFG·Filed 2003·Granted Nov 9, 2004·4 cites·5 claims
- 1963US6365508B1Process without post-etch cleaning-converting polymer and by-products into an inert layerCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Apr 2, 2002·11 cites·20 claims
- 2063US6150260ASacrificial stop layer and endpoint for metal CMPCHARTERED SEMICONDUCTOR MFG·Filed 1998·Granted Nov 21, 2000·27 cites·26 claims
- 2162US6987321B2Copper diffusion deterrent interfaceCHARTERED SEMICONDUCTOR MFG·Filed 2003·Granted Jan 17, 2006·7 cites·20 claims
- 2261US6261955B1Application of vapor phase HFACAC-based compound for use in copper decontamination and cleaning processesCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Jul 17, 2001·6 cites·16 claims
- 2360US6415973B1Method of application of copper solution in flip-chip, COB, and micrometal bondingCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Jul 9, 2002·9 cites·25 claims
- 2459US6391783B1Method to thin down copper barriers in deep submicron geometries by using alkaline earth element, barrier additives, or self assembly techniqueCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted May 21, 2002·6 cites·22 claims
- 2559US6309982B1Method for minimizing copper diffusion by doping an inorganic dielectric layer with a reducing agentCHARTERED SEMICONDUCTOR MFG·Filed 2001·Granted Oct 30, 2001·6 cites·19 claims
- 2659US6156659ALinear CMP tool design with closed loop slurry distributionCHARTERED SEMICONDUCTOR MFG·Filed 1998·Granted Dec 5, 2000·17 cites·12 claims
- 2756US6967162B2Method of copper/copper surface bonding using a conducting polymer for application in IC chip bondingCHARTERED SEMICONDUCTOR MFG·Filed 2004·Granted Nov 22, 2005·4 cites·7 claims
- 2856US6692579B2Method for cleaning semiconductor structures using hydrocarbon and solvents in a repetitive vapor phase/liquid phase sequenceCHARTERED SEMICONDUCTOR MFG·Filed 2001·Granted Feb 17, 2004·5 cites·7 claims
- 2956US6358821B1Method of copper transport prevention by a sputtered gettering layer on backside of waferCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Mar 19, 2002·5 cites·41 claims
- 3050US6821888B2Method of copper/copper surface bonding using a conducting polymer for application in IC chip bondingCHARTERED SEMICONDUCTOR MFG·Filed 2002·Granted Nov 23, 2004·2 cites·16 claims
- 3146US6235635B1Linear CMP tool design using in-situ slurry distribution and concurrent pad conditioningCHARTERED SEMICONDUCTOR MFG·Filed 1998·Granted May 22, 2001·10 cites·15 claims
- 3244US7452808B2Method of copper/copper surface bonding using a conducting polymer for application in IC chip bondingCHARTERED SEMICONDUCTOR MFG·Filed 2004·Granted Nov 18, 2008·0 cites·6 claims
- 3344US7060613B2Method of copper/copper surface bonding using a conducting polymer for application in IC chip bondingCHARTERED SEMICONDUCTOR MFG·Filed 2004·Granted Jun 13, 2006·0 cites·4 claims
- 3443US2005090037A1Method of copper/copper surface bonding using a conducting polymer for application in IC chip bondingCHARTERED SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 3540US2002048950A1Application of vapor phase HFACAC-based compound for use in copper decontamination and cleaning processesCHARTERED SEMICONDUCTOR MFG·Filed 2001·Application pending·0 cites
- 3634US5370736AHorizontal reactor hardware designTEXAS INSTRUMENTS INC·Filed 1992·Granted Dec 6, 1994·11 cites·19 claims
- 3730US6670209B1Embedded metal scheme for liquid crystal display (LCD) applicationCHARTERED SEMICONDUCTOR MFG·Filed 1998·Granted Dec 30, 2003·0 cites·27 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →