Inventor · disambiguated record
Sung Wuk Ryu
Also filed as: RYU SUNG WUK
15 granted patents·4 pending applications·23 citations·filing 2009–2024
88Inventor score
Top patents by PatentIndex Score
19 records- 0181US9867296B2Printed circuit board and package substrateLG INNOTEK CO LTD·Filed 2015·Granted Jan 9, 2018·4 cites·6 claims
- 0280US12160955B2Circuit boardLG INNOTEK CO LTD·Filed 2021·Granted Dec 3, 2024·1 cites·16 claims
- 0380US12089329B2Printed circuit board comprising via portionsLG INNOTEK CO LTD·Filed 2020·Granted Sep 10, 2024·1 cites·13 claims
- 0479US9706652B2Printed circuit board and method for manufacturing sameRYU SUNG WUK·Filed 2011·Granted Jul 11, 2017·6 cites·9 claims
- 0578US12213253B2Printed circuit boardLG INNOTEK CO LTD·Filed 2020·Granted Jan 28, 2025·1 cites·11 claims
- 0678US2024381527A1Printed circuit boardLG INNOTEK CO LTD·Filed 2024·Application pending·0 cites
- 0778US2024397619A1Printed circuit boardLG INNOTEK CO LTD·Filed 2024·Application pending·0 cites
- 0873US9252112B2Semiconductor packageLG INNOTEK CO LTD·Filed 2014·Granted Feb 2, 2016·3 cites·16 claims
- 0967US8659131B2Structure for multi-row lead frame and semiconductor package capable of minimizing an under-cutKIM JI YUN·Filed 2009·Granted Feb 25, 2014·4 cites·3 claims
- 1065US12089325B2Printed circuit boardLG INNOTEK CO LTD·Filed 2020·Granted Sep 10, 2024·0 cites·16 claims
- 1165US9748192B2Printed circuit board having a post bumpLG INNOTEK CO LTD·Filed 2014·Granted Aug 29, 2017·1 cites·10 claims
- 1261US9363883B2Printed circuit board and method for manufacturing sameRYU SUNG WUK·Filed 2011·Granted Jun 7, 2016·1 cites·13 claims
- 1359US10062623B2Semiconductor package substrate, package system using the same and method for manufacturing thereofLG INNOTEK CO LTD·Filed 2013·Granted Aug 28, 2018·1 cites·3 claims
- 1446US9589878B2Semiconductor packageLG INNOTEK CO LTD·Filed 2015·Granted Mar 7, 2017·0 cites·14 claims
- 1546US2023413425A1Circuit boardLG INNOTEK CO LTD·Filed 2021·Application pending·0 cites
- 1645US9466543B2Semiconductor package substrate, package system using the same and method for manufacturing thereofLG INNOTEK CO LTD·Filed 2013·Granted Oct 11, 2016·0 cites·9 claims
- 1741US8956919B2Structure for multi-row leadframe and semiconductor package thereof and manufacture method thereofCHUN HYUN A·Filed 2009·Granted Feb 17, 2015·0 cites·11 claims
- 1833US10134679B2Printed circuit board, package substrate comprising same, and method for manufacturing sameLG INNOTEK CO LTD·Filed 2015·Granted Nov 20, 2018·0 cites·9 claims
- 1932US2016351543A1Printed circuit board, package substrate and production method for sameLG INNOTEK CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →