Inventor · disambiguated record

Subaramaniym Senivasan

Also filed as: SENIVASAN SUBARAMANIYM

5 granted patents·1 pending application·1 citations·filing 2012–2024

62Inventor score

Technology areasH10W

Files withINFINEON TECHNOLOGIES AG6

Top patents by PatentIndex Score

6 records

0181US11908771B2Power semiconductor device with dual heat dissipation structuresINFINEON TECHNOLOGIES AG·Filed 2021·Granted Feb 20, 2024·1 cites·23 claims
0271US12334414B2Power semiconductor device with dual heat dissipation structuresINFINEON TECHNOLOGIES AG·Filed 2024·Granted Jun 17, 2025·0 cites·24 claims
0360US2025105102A1Power semiconductor device having a solder bleed out prevention layer and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
0449US12512435B2Semiconductor package having a solder wetting structureINFINEON TECHNOLOGIES AG·Filed 2023·Granted Dec 30, 2025·0 cites·23 claims
0545US12191229B2Semiconductor package with blind hole attachment to heat sinkINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 7, 2025·0 cites·20 claims
0644US9196521B2Adjustable pick-up head and method for manufacturing a deviceINFINEON TECHNOLOGIES AG·Filed 2012·Granted Nov 24, 2015·0 cites·17 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →