Inventor · disambiguated record
Sunkyoung Seo
Also filed as: SEO SUNKYOUNG
21 granted patents·12 pending applications·19 citations·filing 2015–2025
91Inventor score
Technology areasH10W
Top patents by PatentIndex Score
33 records- 0195US11444060B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 13, 2022·4 cites·20 claims
- 0293US11923342B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 5, 2024·2 cites·19 claims
- 0393US11222873B2Semiconductor packages including stacked substrates and penetration electrodesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 11, 2022·3 cites·20 claims
- 0492US11848293B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 19, 2023·2 cites·19 claims
- 0591US11935873B2Methods of inspection of semiconductor packages including measurement of alignment accuracy among semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 19, 2024·1 cites·17 claims
- 0689US11574873B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 7, 2023·2 cites·17 claims
- 0779US11482509B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 25, 2022·1 cites·20 claims
- 0878US2024404955A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0976US12087696B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 10, 2024·0 cites·19 claims
- 1076US10192855B2Semiconductor package and electronic device having heat dissipation pattern and/or heat conducting lineSEO SUNKYOUNG·Filed 2015·Granted Jan 29, 2019·4 cites·20 claims
- 1175US12400980B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 26, 2025·0 cites·20 claims
- 1275US2025343205A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1372US12362344B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 1471US11621250B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 4, 2023·0 cites·20 claims
- 1567US2024222217A1Semiconductor package including high thermal conductivity layerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1666US12381185B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 5, 2025·0 cites·20 claims
- 1766US11869818B2Chip-stacked semiconductor package and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 9, 2024·0 cites·12 claims
- 1863US12021073B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 25, 2024·0 cites·20 claims
- 1962US11328966B2Chip-stacked semiconductor package and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 10, 2022·0 cites·20 claims
- 2059US2025022828A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2158US11948851B2Semiconductor package including high thermal conductivity layerSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 2, 2024·0 cites·19 claims
- 2258US2025105127A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2358US2025149479A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2457US2024128236A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2554US2024387483A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2654US2024290669A1Semiconductor structure and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2754US2024113057A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2853US11735566B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 22, 2023·0 cites·19 claims
- 2952US11710757B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 25, 2023·0 cites·19 claims
- 3051US2023138813A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3150US11776941B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 3, 2023·0 cites·20 claims
- 3249US11942446B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 26, 2024·0 cites·19 claims
- 3347US2025372537A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →