Inventor · disambiguated record
Sujit Sharan
Also filed as: SHARAN SUJIT
198 granted patents·33 pending applications·4,407 citations·filing 1994–2025
99Inventor score
Top patents by PatentIndex Score
231 records- 0199US10177083B2Alternative surfaces for conductive pad layers of silicon bridges for semiconductor packagesINTEL CORP·Filed 2015·Granted Jan 8, 2019·39 cites·25 claims
- 0299US6756293B2Combined gate cap or digit line and spacer deposition using HDPMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 29, 2004·495 cites·35 claims
- 0398US11626372B2Metal-free frame design for silicon bridges for semiconductor packagesINTEL CORP·Filed 2021·Granted Apr 11, 2023·4 cites·18 claims
- 0498US8227904B2Multi-chip package and method of providing die-to-die interconnects in sameBRAUNISCH HENNING·Filed 2009·Granted Jul 24, 2012·174 cites·3 claims
- 0598US7268078B2Chemical vapor deposition of titanium from titanium tetrachloride and hydrocarbon reactantsMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 11, 2007·50 cites·26 claims
- 0698US5533924APolishing apparatus, a polishing wafer carrier apparatus, a replacable component for a particular polishing apparatus and a process of polishing wafersMICRON TECHNOLOGY INC·Filed 1994·Granted Jul 9, 1996·198 cites·23 claims
- 0797US11742261B2Nested architectures for enhanced heterogeneous integrationINTEL CORP·Filed 2022·Granted Aug 29, 2023·2 cites·20 claims
- 0897US6499425B1Quasi-remote plasma processing method and apparatusMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 31, 2002·326 cites·38 claims
- 0996US10916514B2Metal-free frame design for silicon bridges for semiconductor packagesINTEL CORP·Filed 2019·Granted Feb 9, 2021·9 cites·20 claims
- 1096US10236209B2Passive components in vias in a stacked integrated circuit packageINTEL CORP·Filed 2014·Granted Mar 19, 2019·22 cites·19 claims
- 1196US5664988AProcess of polishing a semiconductor wafer having an orientation edge discontinuity shapeMICRON TECHNOLOGY INC·Filed 1996·Granted Sep 9, 1997·140 cites·14 claims
- 1295US10763216B2Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2019·Granted Sep 1, 2020·7 cites·19 claims
- 1395US6412437B1Plasma enhanced chemical vapor deposition reactor and plasma enhanced chemical vapor deposition processMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 2, 2002·54 cites·28 claims
- 1495US5735960AApparatus and method to increase gas residence time in a reactorMICRON TECHNOLOGY INC·Filed 1996·Granted Apr 7, 1998·119 cites·30 claims
- 1593US11355427B2Device, method and system for providing recessed interconnect structures of a substrateINTEL CORP·Filed 2016·Granted Jun 7, 2022·14 cites·19 claims
- 1693US9875969B2Multi-chip package and method of providing die-to-die interconnects in sameBRAUNISCH HENNING·Filed 2012·Granted Jan 23, 2018·12 cites·6 claims
- 1793US7402512B2High aspect ratio contact structure with reduced silicon consumptionMICRON TECHNOLOGY INC·Filed 2005·Granted Jul 22, 2008·18 cites·6 claims
- 1893US5990021AIntegrated circuit having self-aligned CVD-tungsten/titanium contact plugs strapped with metal interconnect and method of manufactureMICRON TECHNOLOGY INC·Filed 1997·Granted Nov 23, 1999·156 cites·11 claims
- 1993US5644166ASacrificial CVD germanium layer for formation of high aspect ratio submicron VLSI contactsMICRON TECHNOLOGY INC·Filed 1995·Granted Jul 1, 1997·96 cites·23 claims
- 2092US6468925B2Plasma enhanced chemical vapor deposition processMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 22, 2002·44 cites·11 claims
- 2192US6110820ALow scratch density chemical mechanical planarization processMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 29, 2000·126 cites·15 claims
- 2292US5882978AMethods of forming a silicon nitride film, a capacitor dielectric layer and a capacitorMICRON TECHNOLOGY INC·Filed 1997·Granted Mar 16, 1999·99 cites·5 claims
- 2391US10923429B2Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2020·Granted Feb 16, 2021·2 cites·20 claims
- 2491US10510669B2Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2018·Granted Dec 17, 2019·4 cites·7 claims
- 2591US6291341B1Method for PECVD deposition of selected material filmsMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 18, 2001·81 cites·18 claims
- 2691US6227141B1RF powered plasma enhanced chemical vapor deposition reactor and methodsMICRON TECHNOLOGY INC·Filed 2000·Granted May 8, 2001·35 cites·35 claims
- 2790US10461047B2Metal-free frame design for silicon bridges for semiconductor packagesINTEL CORP·Filed 2015·Granted Oct 29, 2019·5 cites·25 claims
- 2890US6112697ARF powered plasma enhanced chemical vapor deposition reactor and methodsMICRON TECHNOLOGY INC·Filed 1998·Granted Sep 5, 2000·59 cites·26 claims
- 2990US5976976AMethod of forming titanium silicide and titanium by chemical vapor depositionMICRON TECHNOLOGY INC·Filed 1997·Granted Nov 2, 1999·65 cites·15 claims
- 3089US11380643B2Rounded metal trace corner for stress reductionINTEL CORP·Filed 2020·Granted Jul 5, 2022·2 cites·20 claims
- 3189US5731235AMethods of forming a silicon nitrite film, a capacitor dielectric layer and a capacitorMICRON TECHNOLOGY INC·Filed 1996·Granted Mar 24, 1998·76 cites·24 claims
- 3289US2025070056A1Metal-free frame design for silicon bridges for semiconductor packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 3389US2024429173A1Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2024·Application pending·0 cites
- 3488US11728294B2Capacitor die embedded in package substrate for providing capacitance to surface mounted dieINTEL CORP·Filed 2021·Granted Aug 15, 2023·1 cites·22 claims
- 3588US7229666B2Chemical vapor deposition methodMICRON TECHNOLOGY INC·Filed 2004·Granted Jun 12, 2007·34 cites·19 claims
- 3688US7185384B2Wafer cleaning brushINTEL CORP·Filed 2005·Granted Mar 6, 2007·17 cites·10 claims
- 3788US6388284B2Capacitor structuresMICRON TECHNOLOGY INC·Filed 2001·Granted May 14, 2002·44 cites·29 claims
- 3888US5747116AMethod of forming an electrical contact to a silicon substrateMICRON TECHNOLOGY INC·Filed 1996·Granted May 5, 1998·88 cites·29 claims
- 3987US2025029908A1Guard ring design enabling in-line testing of silicon bridges for semiconductor packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 4086US12113026B2Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 4186US6331493B1Process for making low dielectric constant dielectric filmsMICRON TECHNOLOGY INC·Filed 2000·Granted Dec 18, 2001·28 cites·39 claims
- 4286US6235646B1RF powered plasma enhanced chemical vapor deposition reactor and methods of effecting plasma enhanced chemical vapor depositionMICRON TECHNOLOGY INC·Filed 2000·Granted May 22, 2001·16 cites·21 claims
- 4386US5700716AMethod for forming low contact resistance contacts, vias, and plugs with diffusion barriersMICRON TECHNOLOGY INC·Filed 1996·Granted Dec 23, 1997·60 cites·25 claims
- 4485US12243812B2Alternative surfaces for conductive pad layers of silicon bridges for semiconductor packagesINTEL CORP·Filed 2023·Granted Mar 4, 2025·0 cites·16 claims
- 4585US12243806B2Nested architectures for enhanced heterogeneous integrationINTEL CORP·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 4685US5846881ALow cost DRAM metallizationMICRON TECHNOLOGY INC·Filed 1995·Granted Dec 8, 1998·52 cites·22 claims
- 4784US12142545B2Nested architectures for enhanced heterogeneous integrationINTEL CORP·Filed 2023·Granted Nov 12, 2024·0 cites·20 claims
- 4884US6727173B2Semiconductor processing methods of forming an utilizing antireflective material layers, and methods of forming transistor gate stacksMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 27, 2004·23 cites·18 claims
- 4984US6268282B1Semiconductor processing methods of forming and utilizing antireflective material layers, and methods of forming transistor gate stacksMICRON TECHNOLOGY INC·Filed 1998·Granted Jul 31, 2001·52 cites·16 claims
- 5084US2024321785A1Capacitor die embedded in package substrate for providing capacitance to surface mounted dieINTEL CORP·Filed 2024·Application pending·0 cites
Showing the top 50 of 231 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →