Inventor · disambiguated record
Suresh Sridaran
Also filed as: SRIDARAN SURESH
10 granted patents·1 pending application·85 citations·filing 2012–2017
87Inventor score
Top patents by PatentIndex Score
11 records- 0194US9444428B2Film bulk acoustic resonators comprising backside viasAVAGO TECHNOLOGIES GENERAL IP·Filed 2014·Granted Sep 13, 2016·23 cites·59 claims
- 0292US9876483B2Acoustic resonator device including trench for providing stress reliefAVAGO TECHNOLOGIES GENERAL IP·Filed 2014·Granted Jan 23, 2018·23 cites·24 claims
- 0392US9608592B2Film bulk acoustic wave resonator (FBAR) having stress-reliefAVAGO TECHNOLOGIES GENERAL IP·Filed 2014·Granted Mar 28, 2017·16 cites·38 claims
- 0490US9667220B2Temperature controlled acoustic resonator comprising heater and sense resistorsAVAGO TECHNOLOGIES GENERAL IP·Filed 2014·Granted May 30, 2017·13 cites·26 claims
- 0586US9036951B2Silicon acousto-optic modulator structure and methodBHAVE SUNIL·Filed 2012·Granted May 19, 2015·6 cites·36 claims
- 0672US9667218B2Temperature controlled acoustic resonator comprising feedback circuitAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Granted May 30, 2017·2 cites·18 claims
- 0765US10804877B2Film bulk acoustic wave resonator (FBAR) having stress-reliefAVAGO TECH INT SALES PTE LID·Filed 2017·Granted Oct 13, 2020·1 cites·20 claims
- 0863US10536133B2Composite surface acoustic wave (SAW) device with absorbing layer for suppression of spurious responsesAVAGO TECH INT SALES PTE LID·Filed 2016·Granted Jan 14, 2020·1 cites·14 claims
- 0949US2017179924A1Film bulk acoustic wave resonator (fbar) having stress-reliefAVAGO TECHNOLOGIES GENERAL IP·Filed 2017·Application pending·0 cites
- 1043US10804875B2Polymer lid wafer-level package with an electrically and thermally conductive pillarAVAGO TECH INT SALES PTE LID·Filed 2017·Granted Oct 13, 2020·0 cites·24 claims
- 1140US10177734B2Surface acoustic wave (SAW) resonatorAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Granted Jan 8, 2019·0 cites·27 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →