Inventor · disambiguated record
Susan Swindlehurst
Also filed as: SWINDLEHURST SUSAN · SWINDLEHURST SUSAN J
8 granted patents·2 pending applications·446 citations·filing 1999–2021
90Inventor score
Files withALIEN TECHNOLOGY CORP3AGILENT TECHNOLOGIES INC2HEWLETT PACKARD CO2SWINDLEHURST SUSAN2AMAZON TECH INC1
Top patents by PatentIndex Score
10 records- 0195US7615479B1Assembly comprising functional block deposited thereinALIEN TECHNOLOGY CORP·Filed 2005·Granted Nov 10, 2009·58 cites·3 claims
- 0293US7576656B2Apparatuses and methods for high speed bondingALIEN TECHNOLOGY CORP·Filed 2006·Granted Aug 18, 2009·52 cites·20 claims
- 0391US6011314ARedistribution layer and under bump material structure for converting periphery conductive pads to an array of solder bumpsHEWLETT PACKARD CO·Filed 1999·Granted Jan 4, 2000·189 cites·19 claims
- 0490US7214569B2Apparatus incorporating small-feature-size and large-feature-size components and method for making sameALIEN TECHNOLOGY CORP·Filed 2004·Granted May 8, 2007·80 cites·27 claims
- 0575US6085968ASolder retention ring for improved solder bump formationHEWLETT PACKARD CO·Filed 1999·Granted Jul 11, 2000·36 cites·5 claims
- 0660US6146984AMethod and structure for uniform height solder bumps on a semiconductor waferAGILENT TECHNOLOGIES INC·Filed 1999·Granted Nov 14, 2000·21 cites·14 claims
- 0755US6268656B1Method and structure for uniform height solder bumps on a semiconductor waferAGILENT TECHNOLOGIES INC·Filed 2000·Granted Jul 31, 2001·10 cites·6 claims
- 0853US12225336B1Systems and methods to secure fabric to speaker-based devicesAMAZON TECH INC·Filed 2021·Granted Feb 11, 2025·0 cites·18 claims
- 0948US2007117274A1Apparatus incorporating small-feature-size and large-feature-size components and method for making sameSWINDLEHURST SUSAN·Filed 2007·Application pending·0 cites
- 1046US2006210769A1Method of making a flexible substrate containing self-assembling microstructuresSWINDLEHURST SUSAN·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →