Inventor · disambiguated record
Suresh Upadhyayula
Also filed as: UPADHYAYULA SURESH · UPADHYAYULA SURESH K · UPADHYAYULA SURESH KUMAR
23 granted patents·2 pending applications·120 citations·filing 2005–2022
94Inventor score
Files withSANDISK TECHNOLOGIES INC7SANDISK CORP5UPADHYAYULA SURESH4MICRON TECHNOLOGY INC3SANDISK SEMICONDUCTOR SHANGHAI CO LTD2
Top patents by PatentIndex Score
25 records- 0195US9761290B1Overheat prevention for annealing non-volatile memorySANDISK TECHNOLOGIES LLC·Filed 2016·Granted Sep 12, 2017·15 cites·18 claims
- 0291US8373268B2Semiconductor package including flip chip controller at bottom of die stackSANDISK TECHNOLOGIES INC·Filed 2011·Granted Feb 12, 2013·10 cites·9 claims
- 0384US8987053B2Semiconductor package including flip chip controller at bottom of die stackSANDISK TECHNOLOGIES INC·Filed 2013·Granted Mar 24, 2015·5 cites·11 claims
- 0483US9773766B2Semiconductor device including independent film layer for embedding and/or spacing semiconductor dieSANDISK SEMICONDUCTOR (SHANGHAI) CO LTD·Filed 2013·Granted Sep 26, 2017·8 cites·20 claims
- 0583USD524817SPortable memory storage deviceSANDISK CORP·Filed 2005·Granted Jul 11, 2006·33 cites·1 claims
- 0680US10325881B2Vertical semiconductor device having a stacked die blockSANDISK INFORMATION TECH SHANGAHAI CO LTD·Filed 2017·Granted Jun 18, 2019·4 cites·15 claims
- 0780US8947883B2Low profile wire bonded USB deviceUPADHYAYULA SURESH·Filed 2007·Granted Feb 3, 2015·9 cites·37 claims
- 0878US7867819B2Semiconductor package including flip chip controller at bottom of die stackSANDISK CORP·Filed 2007·Granted Jan 11, 2011·6 cites·15 claims
- 0978US7384817B2Method of assembling semiconductor devices with LEDsSANDISK CORP·Filed 2005·Granted Jun 10, 2008·6 cites·11 claims
- 1076US8022417B2Method of assembling semiconductor devices with LEDSSANDISK TECHNOLOGIES INC·Filed 2010·Granted Sep 20, 2011·3 cites·8 claims
- 1174US8986050B2Connector of a universal serial bus deviceSANDISK TECHNOLOGIES INC·Filed 2013·Granted Mar 24, 2015·3 cites·18 claims
- 1268US8008132B2Etched surface mount islands in a leadframe packageSANDISK TECHNOLOGIES INC·Filed 2007·Granted Aug 30, 2011·5 cites·28 claims
- 1367US8637963B2Radiation-shielded semiconductor deviceUPADHYAYULA SURESH KUMAR·Filed 2011·Granted Jan 28, 2014·3 cites·12 claims
- 1466US7354314B1Electrical connector with grounding pinSANDISK CORP·Filed 2006·Granted Apr 8, 2008·10 cites·24 claims
- 1558US12512437B2Semiconductor device assemblies with balanced wires, and associated methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 1658US12080616B2Reinforced semiconductor device packaging and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Sep 3, 2024·0 cites·15 claims
- 1754US11282746B2Method of manufacturing microelectronic devices, related tools and apparatusMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 22, 2022·0 cites·24 claims
- 1854US7812356B2Method of assembling semiconductor devices with LEDSSANDISK CORP·Filed 2008·Granted Oct 12, 2010·0 cites·5 claims
- 1951US9218953B2Low profile wire bonded USB deviceSANDISK TECHNOLOGIES INC·Filed 2015·Granted Dec 22, 2015·0 cites·20 claims
- 2042US8637779B2Electronic component including micro ballsUPADHYAYULA SURESH·Filed 2011·Granted Jan 28, 2014·0 cites·20 claims
- 2141US8659133B2Etched surface mount islands in a leadframe packageUPADHYAYULA SURESH·Filed 2011·Granted Feb 25, 2014·0 cites·16 claims
- 2241US2015187745A1Solder pillars for embedding semiconductor dieSANDISK SEMICONDUCTOR SHANGHAI CO LTD·Filed 2014·Application pending·0 cites
- 2339US8575739B2Col-based semiconductor package including electrical connections through a single layer leadframeUPADHYAYULA SURESH·Filed 2011·Granted Nov 5, 2013·0 cites·24 claims
- 2435US2013015589A1Chip-on-package structure for multiple die stacksLIAO CHIH-CHIN·Filed 2011·Application pending·0 cites
- 2534US10177128B2Semiconductor device including support pillars on solder maskSANDISK TECHNOLOGIES INC·Filed 2015·Granted Jan 8, 2019·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →