Inventor · disambiguated record
Sung-Yueh Wu
Also filed as: WU SUNG-YUEH
9 granted patents·8 pending applications·6 citations·filing 2014–2025
79Inventor score
Top patents by PatentIndex Score
17 records- 0192US11756872B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 12, 2023·2 cites·20 claims
- 0291US11764127B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 19, 2023·2 cites·20 claims
- 0382US2025323182A1Semiconductor packages and methods of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0480US12176279B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 0579US2025087571A1Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0677US12040255B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
- 0776US2024332132A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0873US2024379404A1Apparatus and method for substrate handlingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0970US11532551B2Semiconductor package with chamfered semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 20, 2022·1 cites·20 claims
- 1070US2023387039A1Semicondcutor packages and methods of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1161US2022319903A1Apparatus and method for substrate handlingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 1259US10052063B2Sensing bone fixing elementUNIV NATIONAL CHIAO TUNG·Filed 2015·Granted Aug 21, 2018·1 cites·12 claims
- 1354US2024234210A1Integrated circuit packages and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1451US10837754B2Wireless passive strain sensor having outer and inner coil holdersUNIV NATIONAL CHIAO TUNG·Filed 2019·Granted Nov 17, 2020·0 cites·9 claims
- 1550US2023268316A1Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1648US10867890B2Mutli-chip package with encapsulated conductor viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·0 cites·20 claims
- 1740US9867551B2Locating system for locking hole of intramedullary nailUNIV NATIONAL CHIAO TUNG·Filed 2014·Granted Jan 16, 2018·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →