Inventor · disambiguated record
Sung Uk Yang
Also filed as: YANG SUNG UK
5 granted patents·4 pending applications·18 citations·filing 2006–2022
73Inventor score
Top patents by PatentIndex Score
9 records- 0179US8779568B2Integrated circuit package system with encapsulation lockDO BYUNG TAI·Filed 2012·Granted Jul 15, 2014·5 cites·8 claims
- 0277US7414310B2Waferscale package systemSTATS CHIPPAC LTD·Filed 2006·Granted Aug 19, 2008·9 cites·20 claims
- 0366US8067271B2Integrated circuit package system with encapsulation lockDO BYUNG TAI·Filed 2006·Granted Nov 29, 2011·4 cites·20 claims
- 0447US8093693B2Integrated circuit package system with encapsulation lockDO BYUNG TAI·Filed 2006·Granted Jan 10, 2012·0 cites·9 claims
- 0546US7919838B2Integrated circuit package system with encapsulation lock and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2010·Granted Apr 5, 2011·0 cites·20 claims
- 0645US2008067639A1Integrated circuit package system with encapsulation lockSTATS CHIPPAC LTD·Filed 2006·Application pending·0 cites
- 0744US2023197098A1System and method for removing noise and echo for multi-party video conference or video educationONTHELIVE CO LTD·Filed 2022·Application pending·0 cites
- 0839US2007178666A1Integrated circuit system with waferscale spacer systemSTATS CHIPPAC LTD·Filed 2006·Application pending·0 cites
- 0936US2019202820A1Process for producing fluorinated compounds using alcohol solvent having carbonyl groupFUTURECHEM CO LTD·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →