Inventor · disambiguated record
Sung-Hsin Yang
Also filed as: YANG SUNG-HSIN
14 granted patents·18 pending applications·7 citations·filing 2020–2025
86Inventor score
Top patents by PatentIndex Score
32 records- 0192US11699702B2Input/output devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 11, 2023·3 cites·20 claims
- 0289US12283595B2Integration of multiple transistors having fin and mesa structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 22, 2025·1 cites·20 claims
- 0389US12119265B2High voltage devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 15, 2024·2 cites·20 claims
- 0484US2025351565A1Semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0582US12224213B2High voltage deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 11, 2025·1 cites·20 claims
- 0681US2024395947A1Finfet mos capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0778US2025142953A1Semiconductor devicesTAIWAN SEMICONDUCTOR MANUFACTUING CO LTD·Filed 2024·Application pending·0 cites
- 0878US2025344488A1High voltage deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0977US12342553B2Semiconductor devices and methods for increased capacitanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 24, 2025·0 cites·20 claims
- 1077US2025287617A1Semiconductor devices and methods for increased capacitanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1176US2025366131A1Semiconductor device and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1275US12199193B2FinFET MOS capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 14, 2025·0 cites·20 claims
- 1374US2024387284A1High voltage deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1473US2024387531A1Input/output devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1573US2024387520A1Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1672US11855175B2Fabrication of long gate devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 1771US12336199B2Semiconductor devices and methods for increased capacitanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 17, 2025·0 cites·20 claims
- 1871US11469335B2FinFET MOS capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 11, 2022·0 cites·20 claims
- 1971US2025221033A1Integration of multiple transistors having fin and mesa structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2069US12176347B2Input/output devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 2167US12218134B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 4, 2025·0 cites·20 claims
- 2266US2022376045A1High voltage deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2365US12094874B2Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 17, 2024·0 cites·20 claims
- 2464US2025048706A1Semiconductor device and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2561US11444175B2Fabrication of long gate devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 13, 2022·0 cites·20 claims
- 2660US12477841B2Semiconductor image-sensing structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 18, 2025·0 cites·20 claims
- 2759US2025167004A1Semiconductor device including metal gate structure with specified profile and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2856US2024429260A1Methods for forming a back side film stack and package structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2956US2025079336A1Stress and warpage modulating structure for multi-stacked wafer and die level bonding packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3055US2025054873A1Semiconductor device including an alignment mark and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3155US2025142940A1Semiconductor device including gate dielectrics of different thicknesses and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3254US2025185354A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →