Inventor · disambiguated record
Su-Chun Yang
Also filed as: YANG SU-CHUN
18 granted patents·13 pending applications·10 citations·filing 2012–2025
89Inventor score
Top patents by PatentIndex Score
31 records- 0194US11456256B2Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·3 cites·20 claims
- 0290US11955378B2Bonding method of package components and bonding apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 9, 2024·1 cites·20 claims
- 0388US11443981B2Bonding method of package components and bonding apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 13, 2022·2 cites·20 claims
- 0484US2025357420A1Chip package structure with redistribution layer having bonding portionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0582US2024379569A1Manufacturing method of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0682US2025309189A1Bonding with pre-deoxide process and apparatus for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0779US12125794B2Semiconductor device and manufacturing method of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 0877US12002761B2Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 4, 2024·0 cites·20 claims
- 0975US12463175B2Bonding with pre-deoxide process and apparatus for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 4, 2025·0 cites·20 claims
- 1071US11056459B2Chip package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 6, 2021·1 cites·20 claims
- 1168US9978709B2Solder bump stretching method for forming a solder bump joint in a deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 22, 2018·1 cites·20 claims
- 1268US9893046B2Thinning process using metal-assisted chemical etchingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 13, 2018·1 cites·20 claims
- 1367US12438120B2Chip package structure with redistribution layer having bonding portionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 7, 2025·0 cites·20 claims
- 1463US9475145B2Solder bump joint in a device including lamellar structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 25, 2016·1 cites·20 claims
- 1561US11342302B2Bonding with pre-deoxide process and apparatus for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 24, 2022·0 cites·20 claims
- 1660US12394684B2Die stacking structure, semiconductor package and formation method of the die stacking structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 19, 2025·0 cites·20 claims
- 1760US2025277936A1Waveguides and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1860US2025258338A1Optical device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1958US9842817B2Solder bump stretching method and device for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 12, 2017·0 cites·6 claims
- 2057US10163835B2Solder bump stretching methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·0 cites·20 claims
- 2156US11101195B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 24, 2021·0 cites·20 claims
- 2255US2025372398A1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2355US2025366372A1Wafer formation and processing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2453US9263407B2Method for manufacturing a plurality of metal postsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 16, 2016·0 cites·7 claims
- 2553US2024363586A1Semiconductor package and forming method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2652US2023360993A1Die stacking structure, semiconductor package and manufacturing method of the die stacking structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2752US2024371818A1Edge fill for stacked structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2851US10034390B2Metal post bonding using pre-fabricated metal postsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 24, 2018·0 cites·20 claims
- 2948US2025053064A1Optical devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3039US2013221074A1Solder bump stretching methodWEI CHENG-CHANG·Filed 2012·Application pending·0 cites
- 3136US2017330855A1System and Method for Immersion BondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →