Inventor · disambiguated record
Suresh Reddy Yarragunta
Also filed as: YARRAGUNTA SURESH REDDY
7 granted patents·13 pending applications·2 citations·filing 2018–2025
72Inventor score
Top patents by PatentIndex Score
20 records- 0185US12284788B2Apparatus including thermal management mechanism and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2023·Granted Apr 22, 2025·1 cites·20 claims
- 0276US11751357B2Apparatus including thermal management mechanism and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2021·Granted Sep 5, 2023·1 cites·23 claims
- 0376US2025331097A1Data throughput using a fin stackMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0475US2025351260A1Pcb enclosureMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0574US2025234493A1Apparatus including thermal management mechanism and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0673US12363820B2Data throughput using a fin stackMICRON TECHNOLOGY INC·Filed 2023·Granted Jul 15, 2025·0 cites·20 claims
- 0770US12432880B2Integrated bracket for enhanced heat dissipationMICRON TECHNOLOGY INC·Filed 2023·Granted Sep 30, 2025·0 cites·20 claims
- 0870US12402242B2Memory sub-system enclosureMICRON TECHNOLOGY INC·Filed 2023·Granted Aug 26, 2025·0 cites·20 claims
- 0955US2025028448A1Data throughput using tcmMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1055US2025208689A1Power envelope modification for memory systems based on time to thermal throttleMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1152US12490407B2Liquid cooling manifoldMICRON TECHNOLOGY INC·Filed 2023·Granted Dec 2, 2025·0 cites·15 claims
- 1250US12068055B2Managing performance and service life prediction for a memory subsystem using environmental factorsMICRON TECHNOLOGY INC·Filed 2022·Granted Aug 20, 2024·0 cites·20 claims
- 1350US2024172398A1Data throughput using a metal bracketMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1449US2024268077A1Memory sub-system enclosureMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1549US2024194565A1Cooling system for a semiconductor device assemblyMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1648US2024179873A1Heat transfer devices for enhanced thermal performance of electronic systemsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1745US2024244779A1Solid state drive enclosureMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1841US2024196569A1Thermal isolation for memory systemsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1941US2024114660A1Unified solid-state drive enclosure designMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 2040US2019361508A1Temperature-based dynamic fan controlSEAGATE TECHNOLOGY LLC·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →