Inventor · disambiguated record
Sung-Wei Yeh
Also filed as: YEH SUNG-WEI
1 granted patent·1 pending application·6 citations·filing 2014–2014
28Inventor score
Files withMETAL IND RES & DEV CT2
Top patents by PatentIndex Score
2 records- 0169US9312235B1Aluminum-based alloy conductive wire used in semiconductor package and manufacturing method thereofMETAL IND RES & DEV CT·Filed 2014·Granted Apr 12, 2016·6 cites·4 claims
- 0237US2015203940A1Brass alloy and method for manufacturing the sameMETAL IND RES & DEV CT·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →