Inventor · disambiguated record
Sung-Feng Yeh
Also filed as: YEH SUNG-FENG
161 granted patents·60 pending applications·821 citations·filing 2008–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD216NAN YA PRINTED CIRCUIT BOARD1TAIWAN SEMICONDUCTOR MFG1TAIWAN SEMICONDUCTOR MQANUFACTURING CO LTD1TAIWAN SEMICONDUTOR MFG CO LTD1
Top patents by PatentIndex Score
221 records- 0199US11233035B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 25, 2022·8 cites·20 claims
- 0299US10541227B2System on integrated chips and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 21, 2020·47 cites·20 claims
- 0399US10510650B2Method of manufacturing semiconductor device packaging structure having through interposer vias and through substrate viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·67 cites·20 claims
- 0499US9859254B1Semiconductor structure and a manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·102 cites·20 claims
- 0599US9524959B1System on integrated chips and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 20, 2016·67 cites·20 claims
- 0698US11742297B2Semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 29, 2023·4 cites·20 claims
- 0798US11502062B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 15, 2022·12 cites·20 claims
- 0898US11456240B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·4 cites·20 claims
- 0998US11387209B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 12, 2022·4 cites·20 claims
- 1098US11342297B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·4 cites·20 claims
- 1198US11309223B2Method of forming semiconductor device package having dummy devices on a first dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 19, 2022·7 cites·20 claims
- 1298US11264343B2Bond pad structure for semiconductor device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 1, 2022·5 cites·20 claims
- 1398US10290571B2Packages with si-substrate-free interposer and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 14, 2019·23 cites·20 claims
- 1498US9899355B2Three-dimensional integrated circuit structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 20, 2018·71 cites·16 claims
- 1597US12199024B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 14, 2025·2 cites·20 claims
- 1697US11955433B2Package-on-package deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 9, 2024·3 cites·20 claims
- 1797US11854921B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·4 cites·20 claims
- 1897US11854785B2Package structure for heat dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·2 cites·20 claims
- 1997US11848246B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 19, 2023·3 cites·20 claims
- 2097US11756933B2Inactive structure on SoICTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 12, 2023·4 cites·20 claims
- 2197US11705423B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 18, 2023·2 cites·20 claims
- 2297US11699638B2Package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 11, 2023·8 cites·20 claims
- 2397US11676942B2Semiconductor structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 13, 2023·3 cites·20 claims
- 2497US11527465B2Packages with Si-substrate-free interposer and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 13, 2022·3 cites·20 claims
- 2597US11476201B2Package-on-package deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 18, 2022·5 cites·20 claims
- 2697US11417629B2Three-dimensional stacking structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·4 cites·16 claims
- 2797US11362064B2Semiconductor package with shared barrier layer in redistribution and viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 14, 2022·4 cites·20 claims
- 2897US11309291B2Die stack structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 19, 2022·3 cites·20 claims
- 2997US10672674B2Method of forming semiconductor device package having testing pads on a topmost dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 2, 2020·17 cites·20 claims
- 3097US10163750B2Package structure for heat dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·14 cites·20 claims
- 3197US10026716B23DIC formation with dies bonded to formed RDLsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 17, 2018·20 cites·20 claims
- 3297US9806055B2Chip-on-wafer package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 31, 2017·19 cites·20 claims
- 3396US12218026B2Package structure for heat dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·1 cites·20 claims
- 3496US11756907B2Bonding structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 12, 2023·2 cites·20 claims
- 3596US11380653B2Die stack structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 5, 2022·3 cites·20 claims
- 3696US11373981B2Package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 28, 2022·5 cites·20 claims
- 3796US11164848B2Semiconductor structure and method manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 2, 2021·6 cites·20 claims
- 3896US11043482B2Semiconductor component, package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 22, 2021·5 cites·20 claims
- 3996US10867879B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·13 cites·20 claims
- 4096US10475762B13DIC structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 12, 2019·12 cites·19 claims
- 4196US10163859B2Structure and formation method for chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 25, 2018·16 cites·26 claims
- 4295US12074140B2System formed through package-in-package formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 27, 2024·2 cites·20 claims
- 4395US11916012B2Manufacturing method of semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 27, 2024·2 cites·20 claims
- 4495US11264362B2Semiconductor structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 1, 2022·3 cites·15 claims
- 4595US11024605B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 1, 2021·11 cites·20 claims
- 4695US10872836B2Package structure for heat dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 22, 2020·7 cites·20 claims
- 4795US10658333B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 19, 2020·7 cites·14 claims
- 4894US12308323B2Package-on-package deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted May 20, 2025·1 cites·20 claims
- 4994US11784163B2Stacking structure, package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 10, 2023·2 cites·20 claims
- 5094US10854574B2Forming metal bonds with recessesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 1, 2020·9 cites·19 claims
Showing the top 50 of 221 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →