Inventor · disambiguated record
Sun Yun
Also filed as: YUN SUN · YUN SUN WOONG
3 granted patents·3 pending applications·22 citations·filing 2014–2024
64Inventor score
Technology areasH10W
Files withQUALCOMM INC6
Top patents by PatentIndex Score
6 records- 0189US9536805B2Power management integrated circuit (PMIC) integration into a processor packageQUALCOMM INC·Filed 2014·Granted Jan 3, 2017·12 cites·25 claims
- 0287US10002857B2Package on package (PoP) device comprising thermal interface material (TIM) in cavity of an encapsulation layerQUALCOMM INC·Filed 2016·Granted Jun 19, 2018·10 cites·34 claims
- 0358US2025273596A1Integrated circuit (ic) packages employing stiffener structure with integrated cavity(ies) to enclose an electrical component(s), and related fabrication methodsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0457US2025357448A1Package comprising a passive device with a front side protection layerQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0538US9460980B2Systems, apparatus, and methods for heat dissipationQUALCOMM INC·Filed 2015·Granted Oct 4, 2016·0 cites·30 claims
- 0633US2017271175A1Exposed die mold underfill (muf) with fine pitch copper (cu) pillar assembly and bump densityQUALCOMM INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →