Inventor · disambiguated record
Sven Albers
Also filed as: ALBERS SVEN
46 granted patents·12 pending applications·308 citations·filing 2007–2024
97Inventor score
Top patents by PatentIndex Score
58 records- 0198US8878360B2Stacked fan-out semiconductor chipMEYER THORSTEN·Filed 2012·Granted Nov 4, 2014·71 cites·10 claims
- 0297US11955462B2Package stacking using chip to wafer bondingINTEL CORP·Filed 2021·Granted Apr 9, 2024·3 cites·20 claims
- 0397US9997444B2Microelectronic package having a passive microelectronic device disposed within a package bodyINTEL CORP·Filed 2014·Granted Jun 12, 2018·41 cites·24 claims
- 0497US9312198B2Chip package-in-package and method thereofINTEL MOBILE COMM GMBH·Filed 2013·Granted Apr 12, 2016·39 cites·11 claims
- 0596US9385105B2Semiconductor devicesINTEL DEUTSCHLAND GMBH·Filed 2013·Granted Jul 5, 2016·52 cites·8 claims
- 0695US9985005B2Chip package-in-packageINTEL DEUTSCHLAND GMBH·Filed 2016·Granted May 29, 2018·14 cites·14 claims
- 0789US10403609B2System-in-package devices and methods for forming system-in-package devicesINTEL IP CORP·Filed 2015·Granted Sep 3, 2019·7 cites·25 claims
- 0889US9711492B2Three dimensional structures within mold compoundINTEL CORP·Filed 2014·Granted Jul 18, 2017·8 cites·20 claims
- 0987US10115668B2Semiconductor package having a variable redistribution layer thicknessINTEL IP CORP·Filed 2015·Granted Oct 30, 2018·5 cites·10 claims
- 1085US9564400B2Methods of forming stacked microelectronic dice embedded in a microelectronic substrateINTEL CORP·Filed 2016·Granted Feb 7, 2017·4 cites·19 claims
- 1185US9142475B2Magnetic contactsINTEL CORP·Filed 2013·Granted Sep 22, 2015·6 cites·24 claims
- 1281US10209466B2Integrated circuit packages including an optical redistribution layerINTEL IP CORP·Filed 2016·Granted Feb 19, 2019·3 cites·17 claims
- 1381US9741651B1Redistribution layer linesINTEL IP CORP·Filed 2016·Granted Aug 22, 2017·3 cites·18 claims
- 1481US2024213225A1Package stacking using chip to wafer bondingINTEL CORP·Filed 2024·Application pending·0 cites
- 1579US10553538B2Semiconductor package having a variable redistribution layer thicknessINTEL IP CORP·Filed 2018·Granted Feb 4, 2020·2 cites·19 claims
- 1679US10522485B2Electrical device and a method for forming an electrical deviceINTEL IP CORP·Filed 2015·Granted Dec 31, 2019·3 cites·25 claims
- 1779US9209143B2Die edge side connectionINTEL IP CORP·Filed 2013·Granted Dec 8, 2015·5 cites·24 claims
- 1879US8786105B1Semiconductor device with chip having low-k-layersMEYER THORSTEN·Filed 2013·Granted Jul 22, 2014·5 cites·30 claims
- 1979US7888703B2ESD protection apparatus and electrical circuit including sameINFINEON TECHNOLOGIES AG·Filed 2008·Granted Feb 15, 2011·9 cites·7 claims
- 2078US11239199B2Package stacking using chip to wafer bondingINTEL CORP·Filed 2015·Granted Feb 1, 2022·2 cites·18 claims
- 2177US9888577B2Passive electrical devices with a polymer carrierINTEL CORP·Filed 2014·Granted Feb 6, 2018·3 cites·20 claims
- 2276US9368461B2Contact pads for integrated circuit packagesINTEL CORP·Filed 2014·Granted Jun 14, 2016·4 cites·23 claims
- 2375US9865387B2Electronic package with coil formed on coreINTEL IP CORP·Filed 2015·Granted Jan 9, 2018·1 cites·9 claims
- 2474US10741486B2Electronic components having three-dimensional capacitors in a metallization stackINTEL IP CORP·Filed 2016·Granted Aug 11, 2020·2 cites·25 claims
- 2574US10128205B2Embedded die flip-chip package assemblyINTEL CORP·Filed 2014·Granted Nov 13, 2018·3 cites·25 claims
- 2673US9397019B2Integrated circuit package configurations to reduce stiffnessINTEL IP CORP·Filed 2014·Granted Jul 19, 2016·2 cites·14 claims
- 2770US9373588B2Stacked microelectronic dice embedded in a microelectronic substrateINTEL CORP·Filed 2013·Granted Jun 21, 2016·2 cites·20 claims
- 2869US10672731B2Wafer level package structure with internal conductive layerINTEL IP CORP·Filed 2015·Granted Jun 2, 2020·1 cites·18 claims
- 2967US9818672B2Flow diversion devicesINTEL IP CORP·Filed 2014·Granted Nov 14, 2017·2 cites·7 claims
- 3067US9601468B2Magnetic contactsINTEL CORP·Filed 2016·Granted Mar 21, 2017·1 cites·9 claims
- 3167US9343389B2Magnetic contactsINTEL CORP·Filed 2015·Granted May 17, 2016·1 cites·21 claims
- 3265US11424209B2Wafer level package structure with internal conductive layerINTEL CORP·Filed 2020·Granted Aug 23, 2022·0 cites·20 claims
- 3365US10490527B2Vertical wire connections for integrated circuit packageINTEL IP CORP·Filed 2015·Granted Nov 26, 2019·1 cites·22 claims
- 3462US2018226185A1Electronic package with coil formed on coreINTEL IP CORP·Filed 2018·Application pending·0 cites
- 3560US8154049B2ESD protection apparatus and electrical circuit including sameALBERS SVEN·Filed 2010·Granted Apr 10, 2012·2 cites·21 claims
- 3658US10816742B2Integrated circuit packages including an optical redistribution layerINTEL IP CORP·Filed 2018·Granted Oct 27, 2020·0 cites·8 claims
- 3757US9921694B2Wearable computing deviceINTEL CORP·Filed 2014·Granted Mar 20, 2018·0 cites·4 claims
- 3856US10522454B2Microelectronic package having a passive microelectronic device disposed within a package bodyINTEL CORP·Filed 2018·Granted Dec 31, 2019·0 cites·12 claims
- 3955US8323051B2Device for implementing a dry electrical connection of a motor vehicle lockALBERS SVEN·Filed 2009·Granted Dec 4, 2012·1 cites·1 claims
- 4054US10373844B2Integrated circuit package configurations to reduce stiffnessINTEL IP CORP·Filed 2017·Granted Aug 6, 2019·0 cites·4 claims
- 4154US9653324B2Integrated circuit package configurations to reduce stiffnessINTEL IP CORP·Filed 2016·Granted May 16, 2017·0 cites·7 claims
- 4254US9515049B2Flexibly-wrapped integrated circuit dieINTEL CORP·Filed 2013·Granted Dec 6, 2016·0 cites·7 claims
- 4353US2018150156A1Wearable computing deviceINTEL CORP·Filed 2018·Application pending·0 cites
- 4449US10228725B2Flexible band wearable electronic deviceINTEL IP CORP·Filed 2016·Granted Mar 12, 2019·0 cites·18 claims
- 4549US2017278778A1Microelectronic interconnect adaptorINTEL CORP·Filed 2017·Application pending·0 cites
- 4649US2018068939A1Redistribution layer linesINTEL IP CORP·Filed 2017·Application pending·0 cites
- 4748US8907480B2Chip arrangementsINTEL MOBILE COMM GMBH·Filed 2013·Granted Dec 9, 2014·0 cites·23 claims
- 4848US2017084578A1Flexibly-wrapped integrated circuit dieINTEL CORP·Filed 2016·Application pending·0 cites
- 4947US10411000B2Microelectronic package with illuminated backside exteriorINTEL IP CORP·Filed 2016·Granted Sep 10, 2019·0 cites·20 claims
- 5045US2016240435A1Microelectronic interconnect adaptorINTEL CORP·Filed 2015·Application pending·0 cites
Showing the top 50 of 58 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →