Inventor · disambiguated record
Sven Lamprecht
Also filed as: LAMPRECHT SVEN
9 granted patents·5 pending applications·40 citations·filing 2001–2024
83Inventor score
Files withATOTECH DEUTSCHLAND GMBH7ATOTECH DEUTSCHLAND GMBH & CO KG2MATEJAT KAI-JENS2EWERT INGO1LAMPRECHT SVEN1
Top patents by PatentIndex Score
14 records- 0179US6899803B2Method and device for the regulation of the concentration of metal ions in an electrolyte and use thereofATOTECH DEUTSCHLAND GMBH·Filed 2001·Granted May 31, 2005·14 cites·23 claims
- 0278US8871631B2Method to form solder deposits on substratesLAMPRECHT SVEN·Filed 2011·Granted Oct 28, 2014·9 cites·13 claims
- 0375US10151980B2Method for fine line manufacturingATOTECH DEUTSCHLAND GMBH·Filed 2015·Granted Dec 11, 2018·1 cites·13 claims
- 0473US8507376B2Method to form solder deposits on substratesEWERT INGO·Filed 2009·Granted Aug 13, 2013·10 cites·18 claims
- 0572US8497200B2Method to form solder alloy deposits on substratesMATEJAT KAI-JENS·Filed 2011·Granted Jul 30, 2013·6 cites·11 claims
- 0662US2025354286A1Process for producing copper foil by electrolytic deposition of copperATOTECH DEUTSCHLAND GMBH & CO KG·Filed 2024·Application pending·0 cites
- 0751US2010187121A1Process for the preparation of electrodes for use in a fuel cellATOTECH DEUTSCHLAND GMBH·Filed 2008·Application pending·0 cites
- 0843US11032914B2Method of forming a solderable solder deposit on a contact padATOTECH DEUTSCHLAND GMBH·Filed 2017·Granted Jun 8, 2021·0 cites·17 claims
- 0941US12063751B2Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit boardATOTECH DEUTSCHLAND GMBH & CO KG·Filed 2020·Granted Aug 13, 2024·0 cites·19 claims
- 1040US9680042B2Plated electrical contacts for solar modulesATOTECH DEUTSCHLAND GMBH·Filed 2013·Granted Jun 13, 2017·0 cites·16 claims
- 1138US7520973B2Method for regenerating etching solutions containing iron for the use in etching or pickling copper or copper alloys and an apparatus for carrying out said methodATOTECH DEUTSCHLAND GMBH·Filed 2004·Granted Apr 21, 2009·0 cites·10 claims
- 1237US2015349152A1Method for metallization of solar cell substratesATOTECH DEUTSCHLAND GMBH·Filed 2013·Application pending·0 cites
- 1336US2004245108A1Regeneration method for a plating solutionFiled 2002·Application pending·0 cites
- 1429US2013105329A1Method to form solder deposits and non-melting bump structures on substratesMATEJAT KAI-JENS·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →