Inventor · disambiguated record
Swee Kah Lee
Also filed as: LEE SWEE KAH
28 granted patents·12 pending applications·42 citations·filing 2010–2025
93Inventor score
Files withINFINEON TECHNOLOGIES AG35INFINEON TECHNOLOGIES AUSTRIA AG3GOH SOON LOCK1TORWESTEN HOLGER1
Top patents by PatentIndex Score
40 records- 0190US9475691B1Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs deviceINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 25, 2016·14 cites·20 claims
- 0286US9219025B1Molded flip-clip semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2014·Granted Dec 22, 2015·12 cites·15 claims
- 0384US10396007B2Semiconductor package with plateable encapsulant and a method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 27, 2019·4 cites·13 claims
- 0480US11469161B2Lead frame-based semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Oct 11, 2022·1 cites·23 claims
- 0574US10431560B2Molded semiconductor package having an optical inspection featureINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 1, 2019·2 cites·21 claims
- 0672US9806043B2Method of manufacturing molded semiconductor packages having an optical inspection featureINFINEON TECHNOLOGIES AG·Filed 2016·Granted Oct 31, 2017·2 cites·13 claims
- 0771US11081417B2Manufacturing a package using plateable encapsulantINFINEON TECHNOLOGIES AG·Filed 2019·Granted Aug 3, 2021·1 cites·17 claims
- 0868US10886199B1Molded semiconductor package with double-sided coolingINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jan 5, 2021·1 cites·20 claims
- 0966US9852918B2Embedding additive particles in encapsulant of electronic deviceINFINEON TECHNOLOGIES AG·Filed 2015·Granted Dec 26, 2017·2 cites·22 claims
- 1064US8945990B2Chip package and method of forming the sameTORWESTEN HOLGER·Filed 2012·Granted Feb 3, 2015·2 cites·9 claims
- 1164US2025266311A1Methods for Manufacturing Semiconductor PackagesINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 1259US9287238B2Leadless semiconductor package with optical inspection featureINFINEON TECHNOLOGIES AG·Filed 2013·Granted Mar 15, 2016·1 cites·18 claims
- 1359US2025226297A1Package with carrier having plated bottom surface and sidewallINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1459US2025257469A1Metal component including an intermetallic compound layer and method for manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 1557US2024274563A1Solder structure with disruptable coating as solder spreading protectionINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1656US11174152B2Over-under sensor packaging with sensor spaced apart from control chipINFINEON TECHNOLOGIES AG·Filed 2019·Granted Nov 16, 2021·0 cites·20 claims
- 1755US12232302B2Dipped coated electronic module assembly with enhanced thermal distributionINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted Feb 18, 2025·0 cites·16 claims
- 1855US11274984B2Pressure sensor having a lidless/laminate structureINFINEON TECHNOLOGIES AG·Filed 2020·Granted Mar 15, 2022·0 cites·16 claims
- 1955US10304780B2Device having substrate with conductive pillarsINFINEON TECHNOLOGIES AG·Filed 2018·Granted May 28, 2019·0 cites·10 claims
- 2054US11682644B2Semiconductor device with a heterogeneous solder joint and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jun 20, 2023·0 cites·16 claims
- 2152US12176222B2Semiconductor package with metal posts from structured leadframeINFINEON TECHNOLOGIES AG·Filed 2021·Granted Dec 24, 2024·0 cites·20 claims
- 2252US11302613B2Double-sided cooled molded semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Apr 12, 2022·0 cites·20 claims
- 2352US2020006267A1Molded Semiconductor PackageINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
- 2451US10501312B2Over-under sensor packaging with sensor spaced apart from control chipINFINEON TECHNOLOGIES AG·Filed 2017·Granted Dec 10, 2019·0 cites·20 claims
- 2551US2024006260A1Encapsulated package with exposed electrically conductive structures and sidewall recessINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 2650US11289436B2Semiconductor package having a laser-activatable mold compoundINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Mar 29, 2022·0 cites·13 claims
- 2750US10163812B2Device having substrate with conductive pillarsINFINEON TECHNOLOGIES AG·Filed 2016·Granted Dec 25, 2018·0 cites·8 claims
- 2850US2024186152A1Chip package and method including encapsulating spaced chips by locally curable materialINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 2949US12218038B2Leadframe, semiconductor package and methodINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Feb 4, 2025·0 cites·20 claims
- 3049US2022278085A1Method for connecting an electrical device to a bottom unit by using a solderless jointINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 3149US2024312956A1Subtractive Metal Structuring on Surface of Semiconductor PackageINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 3247US11791169B2Dual step laser processing of an encapsulant of a semiconductor chip packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Oct 17, 2023·0 cites·21 claims
- 3346US9540539B2Primer composition, method of forming a primer layer on a semiconductor device, and method of encapsulating a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jan 10, 2017·0 cites·14 claims
- 3446US2023335516A1Manufacturing package by solderable or sinterable metallic connection structure applied on sacrificial carrierINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 3539US9868632B2Molded cavity package with embedded conductive layer and enhanced sealingINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jan 16, 2018·0 cites·14 claims
- 3638US2020343167A1Leaded Semiconductor PackageINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
- 3736US10914018B2Porous Cu on Cu surface for semiconductor packagesINFINEON TECHNOLOGIES AG·Filed 2019·Granted Feb 9, 2021·0 cites·28 claims
- 3833US2016043050A1Metallization stack and chip arrangementINFINEON TECHNOLOGIES AG·Filed 2015·Application pending·0 cites
- 3932US8304295B2Method of manufacturing an electronic device with a package locking systemGOH SOON LOCK·Filed 2010·Granted Nov 6, 2012·0 cites·20 claims
- 4027US10099411B2Method and apparatus for simultaneously encapsulating semiconductor dies with layered lead frame stripsINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 16, 2018·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →